Method of improving the contact between bipolar plates and membrane electrode assembly of a flat panel fuel cell

Abstract

A flat panel DMFC (direct methanol fuel cell) includes a first electrode plate, a set of membrane assemblies, at least a bonding sheet, a second electrode, and fuel container base. Because of the gap between the first/second electrode plates and the membrane assembly when they are laminated, the present invention provides a method to improve the contact between the first/second electrode plates and the membrane assembly.

1 . A method for improving the contact between bipolar plates and membrane electrode assembly (MEA) of a flat panel fuel cell, comprising: 
 providing a first bipolar plate, a membrane electrode assembly, a second bipolar plate, and at least one bonding sheet; the MEA being disposed on the first bipolar plate, an opening being included in the bonding sheet for containing the MEA, and the second bipolar plate being disposed on the MEA; the first bipolar plate including a first MEA surface contacting the MEA and a fuel surface contacting the fuel, and the second bipolar plate including a second MEA surface contacting the MEA and an air surface contacting the air; a first metal layer being disposed on the fuel surface, a second metal layer being disposed on the first MEA surface, a third metal layer being disposed on the second MEA surface, and a fourth metal layer being disposed on the air surface; the thickness of the second metal layer being greater than the thickness of the first metal layer and the thickness of the third metal layer being greater than the thickness of the fourth metal layer; and    laminating the first bipolar plate, the MEA, the second bipolar plate, and the bonding sheet together for forming a bipolar/MEA assembly.    
   
   
       2 . The method of  claim 1  wherein the flat panel fuel cell is a direct methanol fuel cell (DMFC).  
   
   
       3 . The method of  claim 1  wherein the membrane electrode assembly is a solid state membrane electrode assembly.  
   
   
       4 . The method of  claim 1 , wherein the bonding sheet is a prepreg commonly utilized in the B-stage of a printed circuit board (PCB) fabrication.  
   
   
       5 . The method of  claim 1  wherein the first bipolar plate comprises a first substrate, and a first metal layer and a second metal layer formed thereon.  
   
   
       6 . The method of  claim 5  wherein the first substrate is comprised of glass fiber reinforced polymeric materials.  
   
   
       7 . The method of  claim 5  wherein the first substrate is comprised of glass fiber reinforced polymeric materials derived from ANSI-grade FR-1, FR-2, FR-3, FR-4, FR-5, CEM-1, or CEM-3.  
   
   
       8 . The method of  claim 1  wherein the second bipolar plate comprises a second substrate, and a third metal layer and a fourth metal layer formed thereon.  
   
   
       9 . The method of  claim 8  wherein the second substrate is comprised of glass fiber reinforced polymeric materials.  
   
   
       10 . The method of  claim 8  wherein the second substrate is comprised of glass fiber reinforced polymeric materials derived from ANSI-grade FR-1, FR-2, FR-3, FR-4, FR-5, CEM-1, or CEM-3.