Hybrid integrated circuit device and method of manufacturing the same

Abstract

An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

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       8 . A method of manufacturing a hybrid integrated circuit device, the method comprising: 
 preparing a board having a surface which has been subjected to insulation treatment;    forming conductive patterns on the surface of the board;    forming first grooves in a grid pattern on the surface of the board, and second grooves in a grid pattern on a back surface of the board, the second grooves being larger than the first grooves;    electrically connecting circuit elements to the conductive patterns; and    splitting the board along portions where the first and second grooves are formed.    
   
   
       9 . The method of manufacturing a hybrid integrated circuit device according to  claim 8 , wherein the board is split by rotating a round cutter having no driving force while pressing the round cutter to the first grooves.  
   
   
       10 . The method of manufacturing a hybrid integrated circuit device according to  claim 8 , wherein the board is split by irradiating the first grooves with a laser beam.  
   
   
       11 . The method of manufacturing a hybrid integrated circuit device according to  claim 8 , wherein any of the first and second grooves is formed by rotating a cutting saw at high speed, the cutting saw having cutting edges each in a shape corresponding to a section of the first or second groove.