Polishing pad, chemical mechanical polishing apparatus and method for manufacturing polishing pad

Abstract

A polishing pad with reduced cost and easy manufacturability without waste is provided. A disc-shaped polishing layer 31 having a plurality of through holes 34 formed therein, an adhesive layer 33 provided only in a position in a back surface of the polishing layer 31 where no through hole 34 is formed and a disc-shaped support plate 32 having a flat surface, which is joined to the back surface of the polishing layer 31 by the adhesive layer 33 are provided. Since an adhesive layer 33 is not exposed to bottoms of the through holes 34 of the polishing layer 31 , acting the slurry over the adhesive layer 33 to strip the polishing layer 31 from the support plate 32 is inhibited. Since the through holes 34 formed in the polishing layer 31 do not extend to the support plate 32 , a decrease in the mechanical strength is not caused.

1 . A polishing pad having a multiple-layered structure and being utilized in a chemical mechanical polishing (CMP) process, comprising:
 a disc-shaped polishing layer having a plurality of through holes formed to extend from a front surface to a back surface thereof;   an adhesive layer provided only in a position in a back surface of said polishing layer where said through hole is not formed; and   a disc-shaped support plate having a flat surface, which is joined to said back surface of the polishing layer by said adhesive layer.   
     
     
         2 . The polishing pad according to  claim 1 , wherein a surface of said support plate is exposed in a bottom of said through hole in said polishing layer without disposing said adhesive layer thereon. 
     
     
         3 . A chemical mechanical polishing (CMP) apparatus for performing a CMP process for a workpiece with a polishing pad, comprising:
 the polishing pad as set forth in  claim 1 ;   a disc-shaped platen having a front surface, which is joined to a back surface of said polishing pad;   a pad actuating unit for actuating a rotation of said platen that is provided with said polishing pad;   a slurry supplying unit for supplying a slurry to said polishing pad that is actuated to be rotated; and   a workpiece pressing unit for supporting said workpiece and pressing said workpiece to said polishing pad that is actuated to be rotated.   
     
     
         4 . A chemical mechanical polishing (CMP) apparatus for performing a CMP process for a workpiece with a polishing pad, comprising:
 the polishing pad as set forth in  claim 2 ;   a disc-shaped platen having a front surface, which is joined to a back surface of said polishing pad;   a pad actuating unit for actuating a rotation of said platen that is provided with said polishing pad;   a slurry supplying unit for supplying a slurry to said polishing pad that is actuated to be rotated; and   a workpiece pressing unit for supporting said workpiece and pressing said workpiece to said polishing pad that is actuated to be rotated.   
     
     
         5 . A method for manufacturing a polishing pad, which has a multiple-layered structure and is utilized in a chemical mechanical polishing (CMP) process, including:
 providing an adhesive layer and a stripping form on a back surface of a disc-shaped polishing layer having a front surface serving as a polishing surface;   forming a plurality of through holes, which extend from a surface of said polishing layer through said adhesive layer to a back surface of said stripping form;   stripping said stripping form from the back surface of said polishing layer having said plurality of through holes formed therein; and   joining the back surface of said polishing layer exposed by stripping said stripping form to a surface of a support plate by said adhesive layer.   
     
     
         6 . The method for manufacturing the polishing pad according to  claim 5 , further comprising
 preparing a two-sided tape having a structure including an adhesive layer and stripping forms affixed to both sides of the adhesive layer,   wherein said providing the adhesive layer and the stripping form on the back surface of the disc-shaped polishing layer includes providing an exposed adhesive layer of said two-sided tape onto a back surface of the polishing layer, said exposed adhesive layer of the two-sided tape being exposed by stripping only said stripping form disposed on the front surface of said two-sided tape.   
     
     
         7 . The method for manufacturing the polishing pad according to  claim 5 , wherein said providing the adhesive layer and the stripping form on the back surface of the disc-shaped polishing layer includes pasting said stripping form after said adhesive layer is provided with the back surface of said polishing layer by an application of an adhesive agent.