Multilayer printed circuit board

Abstract

A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.

1 . A multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, 
 wherein    said optical circuit is formed between said insulating layers.    
   
   
       2 . The multilayer printed circuit board according to  claim 1 , 
 wherein    an insulating layer and a conductor circuit are formed and layered on each of two surfaces of said optical circuit.    
   
   
       3 . The multilayer printed circuit board according to  claim 1 , 
 wherein    an optical signal transmitting region is formed so as to penetrate through at least one of said insulating layers, and    at least one end of said optical signal transmitting region and said optical circuit are optically coupled.    
   
   
       4 . The multilayer printed circuit board according to  claim 3 , 
 wherein    said optical signal transmitting region is formed so as to penetrate through one outermost insulating layer, and    a conductor circuit and/or a pad are/is formed in a location on the outside of the other outermost insulating layer and along a line extending from the side of said optical signal transmitting region which is optically coupled with said optical circuits.    
   
   
       5 . The multilayer printed circuit board according to claim 
 wherein    said optical circuits are formed so as to be located in different layers, and    it is visually confirmed that a portion of one optical circuit and a portion of another optical circuit from among the optical circuits in different layers are superposed on one another when viewed in the direction perpendicular to one main surface of the multilayer printed circuit board.    
   
   
       6 . The multilayer printed circuit board according to  claim 1 , 
 wherein    said optical circuit is layered on at least one of said insulating layers, said conductor circuit and another optical circuit by interposing an adhesive layer.    
   
   
       7 . The multilayer printed circuit board according to  claim 1 , 
 wherein    a via hole for connecting conductor circuits sandwiching said insulating layer is formed and said via hole is a penetrating via hole and/or a non-penetrating via hole.    
   
   
       8 . The multilayer printed circuit board according to  claim 7 , 
 wherein    said optical circuit has a core and a clad, and    it is visually confirmed that a portion of said core and a portion of said non-penetrating via hole are superposed on one another when viewed in the direction perpendicular to one main surface of said multilayer printed circuit board.    
   
   
       9 . The multilayer printed circuit board according to claim 1, 
 wherein    said optical circuit is an optical waveguide.    
   
   
       10 . The multilayer printed circuit board according to  claim 4 , 
 wherein    said optical circuit is an optical waveguide.    
   
   
       11 . The multilayer printed circuit board according to  claim 5 , 
 wherein    said optical circuit is an optical waveguide.    
   
   
       12 . The multilayer printed circuit board according to  claim 1 , 
 wherein    said optical circuit is an optical fiber sheet.    
   
   
       13 . The multilayer printed circuit board according to  claim 4 , 
 wherein    said optical circuit is an optical fiber sheet.    
   
   
       14 . The multilayer printed circuit board according to  claim 5 , 
 wherein    said optical circuit is an optical fiber sheet.    
   
   
       15 . The multilayer printed circuit board according to  claim 10 , 
 wherein    said optical circuit is in film form.    
   
   
       16 . The multilayer printed circuit board according to claim  1 , 
 wherein    a transparent solder resist layer is formed as an outermost layer.    
   
   
       17 . The multilayer printed circuit board according to  claim 1 , 
 wherein    a solder resist layer is formed as an outermost layer;    an optical waveguide and an optical connector are fixed on said solder resist; and    said optical waveguide is coupled with said optical connector.    
   
   
       18 . The multilayer printed circuit board according to  claim 3 , 
 wherein    the multiplayer printed circuit board has a plurality of said optical signal transmitting regions, and at least one of said optical signal transmitting regions is not exposed to an outermost part.    
   
   
       19 . The multilayer printed circuit board according to  claim 1 , 
 wherein    an insulating layer, where conductor circuits are formed on both surfaces and furthermore, an optical waveguide is formed on at least one surface, is layered by interposing an insulating layer comprising an adhesive insulating material.    
   
   
       20 . The multilayer printed circuit board according to  claim 1 , 
 wherein    insulating layers where conductor circuits are formed on both surfaces are layered on both surfaces of an optical waveguide film or an optical fiber sheet by interposing an insulating layer comprising an adhesive insulating material.    
   
   
       21 . The multilayer printed circuit board according to  claim 1 , 
 wherein    insulating layers where conductor circuits are formed on both surfaces are layered by interposing an insulating layer comprising an adhesive insulating material on both surfaces of an insulating layer where an optical waveguide is formed on at least one surface.