LED backlight unit without printed circuit board and method of manufacturing the same

Abstract

Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

1 . A Light Emitting Diode (LED) backlight unit without a Printed Circuit Board (PCB), comprising:
 a chassis;   an insulating resin layer formed on the chassis;   circuit patterns formed on the insulating resin layer; and   one or more light source modules mounted on the insulating resin layer and electrically connected to the circuit patterns.   
     
     
         2 . The LED backlight unit as set forth in  claim 1 , wherein the insulating resin layer has a thickness of 200 μm or less. 
     
     
         3 . The LED backlight unit as set forth in  claim 1 , wherein the insulating resin layer is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. 
     
     
         4 . The LED backlight unit as set forth in  claim 1 , wherein the circuit patterns are formed by filling engraved circuit patterns of the insulating resin layer with metal material. 
     
     
         5 . The LED backlight unit as set forth in  claim 4 , wherein the engraved circuit patterns are formed by pressing the insulation resin layer using a stamp having embossed circuit patterns. 
     
     
         6 . The LED backlight unit as set forth in  claim 1 , wherein the light source modules are LED packages. 
     
     
         7 . A method of manufacturing an LED backlight unit without a PCB, comprising the steps of:
 forming an insulating resin layer on a chassis;   forming engraved circuit patterns by engraving circuit patterns on the insulating resin layer;   filling the engraved circuit patterns with metal material or plating the engraved circuit patterns with metal material;   forming circuit patterns by removing metal material that does not fill the engraved circuit patterns; and   mounting one or more light source modules on the insulating resin layer and electrically connecting corresponding light source modules with the circuit patterns.   
     
     
         8 . The method as set forth in  claim 7 , wherein, at the step of forming the insulating resin layer on the chassis, the insulating resin layer has a thickness of 200 μm or less. 
     
     
         9 . The method as set forth in  claim 7 , wherein the step of forming the insulating resin layer on the chassis is performed by laminating insulating resin on the chassis in solid film form or applying insulating resin to the chassis in liquid form. 
     
     
         10 . The method as set forth in  claim 9 , wherein the insulating resin is applied to the chassis in liquid form using a molding method employing spin coating or blade coating. 
     
     
         11 . The method as set forth in  claim 7 , wherein the light source modules are LED packages.