In-situ cleaning processes for semiconductor electroplating electrodes

Abstract

Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring the manual removal of the electrodes from the semiconductor plating equipment. The electrode is placed into the plating liquid and an electrical current having reverse polarity is passed between the electrode and plating liquid. Plating deposits which have accumulated on the electrode are electrochemically dissolved and removed from the electrode.

1 - 48 . (canceled)  
   
   
       49 . A method for processing a semiconductor workpiece within a process vessel, comprising: 
 receiving a semiconductor workpiece at a workpiece holder outside a process vessel;    moving the workpiece holder with the semiconductor workpiece into the process vessel and toward a process plane located within the process vessel while the semiconductor workpiece is inclined at a non-zero angle relative to the process plane;    processing the semiconductor workpiece at the process plane; and    removing the semiconductor workpiece from the workpiece holder.    
   
   
       50 . The method of  claim 49  wherein receiving a semiconductor workpiece at a workpiece holder includes receiving a single semiconductor workpiece at a workpiece holder having only a single position for carrying a workpiece.  
   
   
       51 . The method of  claim 49  wherein moving the workpiece holder with the semiconductor workpiece includes moving the workpiece holder with the semiconductor workpiece toward a generally horizontal process plane while the semiconductor workpiece is oriented at a non-horizontal angle.  
   
   
       52 . The method of  claim 49  wherein receiving a semiconductor workpiece includes receiving the semiconductor workpiece while the workpiece holder is in a first orientation, and wherein the method further comprises rotating the workpiece holder to a second orientation generally inverted from the first orientation before moving the workpiece holder with the semiconductor workpiece toward the process plane.  
   
   
       53 . The method of  claim 49  wherein moving the workpiece holder with the semiconductor workpiece includes at least partially immersing the semiconductor workpiece in a process liquid at the process plane while the semiconductor workpiece is inclined at a non-zero angle relative to the process plane.  
   
   
       54 . The method of  claim 53 , further comprising positioning the semiconductor workpiece to be generally parallel to the process plane while the semiconductor workpiece is at least partially immersed in the process liquid.  
   
   
       55 . The method of  claim 49  wherein processing the semiconductor workpiece includes applying a conductive material to the semiconductor workpiece.  
   
   
       56 . The method of  claim 49  wherein moving the workpiece holder with the semiconductor workpiece toward a process plane includes moving the workpiece holder with the semiconductor workpiece toward a process plane formed at least in part by a processing liquid overflowing a weir.  
   
   
       57 . The method of  claim 49 , further comprising rotating the semiconductor workpiece about multiple axes after receiving the semiconductor workpiece and before processing the semiconductor workpiece.  
   
   
       58 . The method of  claim 49 , further comprising rotating the semiconductor workpiece about an axis generally parallel to the processing plane after receiving the semiconductor workpiece and before processing the semiconductor workpiece.  
   
   
       59 . The method of  claim 49 , further comprising spinning the semiconductor workpiece about an axis generally normal to a face of the semiconductor workpiece that is at least partially immersed in a process liquid at the process plane.  
   
   
       60 . The method of  claim 49  wherein moving the workpiece holder further includes positioning the semiconductor workpiece generally parallel to the process plane.  
   
   
       61 . An apparatus for processing a semiconductor workpiece, comprising: 
 a process vessel having a process plane;    a workpiece support having a tiltable workpiece holder movable between a load/unload position outside the vessel and a process position inside the vessel, the workpiece holder being positioned to carry a semiconductor workpiece at the process plane, the workpiece holder being tiltable to a non-zero angle relative to the process plane and being moveable toward the process plane while tilted at the non-zero angle; and    an actuator operatively coupled to the workpiece holder to move the workpiece holder relative to the process plane while the workpiece holder is tilted at the non-zero angle.    
   
   
       62 . The apparatus of  claim 61 , further comprising an arm pivotably coupled to the workpiece holder.  
   
   
       63 . The apparatus of  claim 61  wherein the workpiece holder is tiltable to a position generally parallel to the process plane.  
   
   
       64 . The apparatus of  claim 61  wherein the process vessel includes an overflow weir, and wherein the process plane is located at the weir.  
   
   
       65 . The apparatus of  claim 61  wherein the workpiece holder is tiltable relative to the process plane between a face-up position for receiving a semiconductor workpiece, and a face-down position for processing the semiconductor workpiece.  
   
   
       66 . The apparatus of  claim 61  wherein the workpiece holder includes a plurality of contact elements positioned to engage an edge region of a semiconductor workpiece.  
   
   
       67 . The apparatus of  claim 61  wherein the workpiece holder is a single-workpiece carrying workpiece holder.