Polishing apparatus

Abstract

A polishing apparatus has a polishing surface, a top ring for holding a semiconductor wafer, and a top ring shaft for pressing the top ring against the polishing surface. The top ring has a retainer ring for holding a peripheral portion of the semiconductor wafer, a housing substantially in a form of a disk which is connected to the top ring shaft, a sliding contact joint interconnecting the retainer ring and the housing in a state such that the retainer ring and the housing are brought into sliding contact with each other.

1 - 14 . (canceled)  
     
     
         15 . A polishing apparatus comprising: 
 a polishing surface;    a top ring shaft; and    a top ring including 
 (i) a retainer ring for holding a peripheral edge portion of a workpiece,  
 (ii) a substantially disk-shaped housing connected to said top ring shaft, and  
 (iii) a joint interconnecting said retainer ring and said housing, said joint having a sufficiently high rigidity in horizontal and vertical directions and a low flexural rigidity,  
   wherein said top ring shaft is for pressing said retainer ring against said polishing surface.    
     
     
         16 . The polishing apparatus as recited in  claim 15 , wherein said joint is disposed outwardly of a center of a radial width of said retainer ring.  
     
     
         17 . The polishing apparatus as recited in  claim 16 , wherein said joint has a constricted cross-section at a vertically central portion thereof.  
     
     
         18 . The polishing apparatus as recited in  claim 15 , wherein said joint has a constricted cross-section at a vertically central portion thereof.