Copper deposition chamber having integrated bevel clean with edge bevel removal detection

Abstract

Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.

1 . An apparatus for inspecting a rotating substrate, comprising: 
 a substrate support configured to support the substrate on a back side and rotate the substrate about a central axis; and    a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the rotating substrate.    
   
   
       2 . The apparatus of  claim 1 , further comprising a data processing unit configured to process signals from the sensor and determine characteristics of the rotating substrate.  
   
   
       3 . The apparatus of  claim 2 , wherein the data processing unit is configured to determine an eccentricity of the rotating substrate relative to the central axis.  
   
   
       4 . The apparatus of  claim 2 , wherein the data processing unit is configured to determine surface conditions of the rotating substrate.  
   
   
       5 . The apparatus of  claim 2 , wherein the sensor is mounted on a nozzle for dispensing an etchant to clean a bevel edge of the rotating substrate.  
   
   
       6 . The apparatus of  claim 5 , wherein the data processing unit is configured to determine width of the bevel edge.  
   
   
       7 . The apparatus of  claim 1 , wherein the sensor is an optical sensor configured to measure a reflected light beam from the front side of the rotating substrate.  
   
   
       8 . The apparatus of  claim 7 , wherein the optical sensor is operably connected to an amplifier and a data acquisition unit.  
   
   
       9 . An apparatus for processing a bevel edge of a rotating substrate, comprising: 
 a chamber body defining a processing volume;    a rotatable substrate support member positioned in the processing volume and configured to support the rotating substrate on a backside;    a pivoting arm positioned above the rotatable substrate support member and connected to the chamber body;    a fluid dispensing nozzle mounted on the pivoting arm for dispensing a processing fluid a front side of the rotating substrate; and    a sensor mounted on the pivoting arm configured to inspect the front side of the rotating substrate simultaneously with processing the rotating substrate.    
   
   
       10 . The apparatus of  claim 9 , further comprising a control unit configured to adjust at least one of the rotatable substrate support member, the pivoting arm, and the fluid dispensing nozzle according to an inspection result from the sensor.  
   
   
       11 . The apparatus of  claim 9 , wherein the pivoting arm is coupled to a servo motor configured to move the pivoting arm substantially radially across the processing volume.  
   
   
       12 . The apparatus of  claim 9 , wherein the sensor is an optical sensor.  
   
   
       13 . The apparatus of  claim 12 , wherein the optical sensor comprises lenses configured for expanding and projecting light beams to the front side of the rotating substrate.  
   
   
       14 . The apparatus of  claim 12 , wherein the sensor is coupled to an analog amplifier and a data acquisition system.  
   
   
       15 . The apparatus of  claim 9 , further comprising a data processing unit coupled to the sensor and configured to calculate characteristics of the bevel edge inspected by the sensor.  
   
   
       16 . The apparatus of  claim 15 , wherein the characteristics comprise at least one of a width of the bevel edge, eccentricity of the bevel edge, and location of contaminations on the bevel edge.  
   
   
       17 . The apparatus of  claim 15 , wherein the data processing unit is further configured to measure eccentricity of the rotating substrate relative to a rotating axis of the rotatable substrate support member.  
   
   
       18 . A method for inspecting a substrate, comprising: 
 providing a rotatable substrate support member;    providing a sensor pivotably positioned above the substrate support member;    positioning the substrate on the substrate support member; and    inspecting a front side of the substrate in a spiral motion by pivoting the sensor while rotating the substrate.    
   
   
       19 . The method of  claim 18 , wherein the inspecting the front side of the substrate comprises: 
 projecting an optical beam onto the front side of the substrate; and    measuring a reflected optical beam from the front side of the substrate.    
   
   
       20 . The method of  claim 19 , wherein the inspecting the front side of the substrate further comprises determining characteristics of the substrate from measurement of the reflected optical beam.  
   
   
       21 . The method of  claim 19 , wherein projecting the optical beam comprises projecting a beam spot on the front side of the substrate, wherein at least one of a rotating rate, pivoting rate, and size of the beam spot is adjusted such that along a given radius, neighboring beam spots overlap one another.  
   
   
       22 . The method of  claim 21 , wherein overlapping ratio is about 30%.  
   
   
       23 . The method of  claim 18 , wherein the pivoting is performed such that the sensor moves radially outwardly and or inwardly in a constant speed.  
   
   
       24 . The method of  claim 18 , further comprising calculating width of a bevel edge along a periphery of the substrate.  
   
   
       25 . The method of  claim 18 , further comprising: 
 providing a chemical nozzle configured to dispensing a processing fluid to the front side to the substrate, wherein the sensor is mounted on a side of the chemical nozzle; and    processing the substrate while inspecting simultaneously.