Thermoelectric cooling apparatus

Abstract

A thermoelectric cooling apparatus is described. The thermoelectric cooling apparatus includes a heat-dissipating barrel, a wind guide, cooling fins, and a guiding fan. The heat-dissipating barrel further includes a thermoelectric chip cooling module and heat-dissipating fins disposed therein to remove the heat exchanged by the thermoelectric chip cooling module. One end of the wind guide is coupled to a heat source of an electronic device, for example, a CPU or a graphic chip of a computer. Another end of the wind guide is coupled to the cooling fins coupled to the thermoelectric chip cooling module. The guiding fan drives air passing through the cooling fins to reduce a temperature thereof and blowing to the heat source to reduce the operating temperature thereof.

1 . A thermoelectric cooling apparatus, comprising:
 a heat-dissipating barrel with a thermoelectric chip cooling module and heat-dissipating fins disposed therein, to remove a heat exchanged by the thermoelectric chip cooling module;   a wind guide coupling to a heat source of an electronic device;   cooling fins disposed between the wind guide and the thermoelectric chip cooling module; and   a guiding fan installed at one end of the wind guide to drive an airflow through the cooling fins so as to reduce a temperature of the airflow, wherein the airflow is blown to the heat source of the electronic device through the wind guide to reduce an operating temperature of the heat source.   
   
   
       2 . The thermoelectric cooling apparatus of  claim 1 , wherein the heat-dissipating barrel further comprises a heat-dissipating barrel fan to remove the heat out of the electronic device. 
   
   
       3 . The thermoelectric cooling apparatus of  claim 1 , wherein the electronic device is a computer. 
   
   
       4 . The thermoelectric cooling apparatus of  claim 3 , wherein the heat source comprises a central processing unit. 
   
   
       5 . The thermoelectric cooling apparatus of  claim 3 , wherein the heat source comprises a graphic chip. 
   
   
       6 . The thermoelectric cooling apparatus of  claim 1 , further comprising heat source dissipating fins coupled to the heat source, the guiding fan blows the airflow to the heat source dissipating fins to reduce the operating temperature of the heat source. 
   
   
       7 . The thermoelectric cooling apparatus of  claim 6 , wherein the airflow passes through the heat source dissipating fins and then is guided into the interior of the electronic device. 
   
   
       8 . The thermoelectric cooling apparatus of  claim 6 , wherein the airflow passes through the heat source dissipating fins and then is exhausted out of the electronic device. 
   
   
       9 . The thermoelectric cooling apparatus of  claim 1 , further comprising a guiding fan installed at another end of the wind guide. 
   
   
       10 . The thermoelectric cooling apparatus of  claim 1 , wherein the airflow is directly sucked from the exterior of the electronic device. 
   
   
       11 . The thermoelectric cooling apparatus of  claim 1 , wherein the wind guide further comprises an inlet wind guide and a wind cover, the inlet wind guide directly sucks air from the exterior of the electronic device to form the airflow, and the wind cover directly covers the guiding fan to fully guide the airflow to the guiding fan. 
   
   
       12 . The thermoelectric cooling apparatus of  claim 1 , wherein the wind guide is made of a heat insulation material. 
   
   
       13 . The thermoelectric cooling apparatus of  claim 1 , wherein the wind guide is made of a plastic material. 
   
   
       14 . A thermoelectric cooling apparatus, comprising:
 a heat-dissipating barrel with a thermoelectric chip cooling module and heat-dissipating fins and a heat-dissipating barrel fan disposed therein, to remove a heat exchanged by the thermoelectric chip cooling module out of an electronic device;   a wind guide coupling to a heat source of the electronic device;   a power supply electrically connecting and providing power to the thermoelectric chip cooling module, the heat source and the heat-dissipating barrel fan;   cooling fins disposed between the wind guide and the thermoelectric chip cooling module;   heat source dissipating fins coupled to the heat source; and   a heat source fan installed on one end of the wind guide to drive an airflow through the cooling fins so as to reduce a temperature of the airflow, wherein the airflow is blown to the heat source dissipating fins of the electronic device to reduce an operating temperature of the heat source.   
   
   
       15 . The thermoelectric cooling apparatus of  claim 14 , wherein the electronic device is a computer. 
   
   
       16 . The thermoelectric cooling apparatus of  claim 15 , wherein the heat source comprises a central processing unit. 
   
   
       17 . The thermoelectric cooling apparatus of  claim 15 , wherein the heat source comprises a graphic chip. 
   
   
       18 . The thermoelectric cooling apparatus of  claim 14 , wherein the airflow passes through the heat source dissipating fins and then is guided into the interior of the electronic device. 
   
   
       19 . The thermoelectric cooling apparatus of  claim 14 , wherein the airflow passes through the heat source dissipating fins and then is emitted out of the electronic device. 
   
   
       20 . The thermoelectric cooling apparatus of  claim 14 , wherein the wind guide further comprises an inlet wind guide and a wind cover, the inlet wind guide directly sucks air from the exterior of the electronic device to form the airflow, and the wind cover directly covers the guiding fan to fully guide the airflow to the guiding fan.