Semiconductor device and heat radiation member

Abstract

A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a backside of the semiconductor element by a bonding material. The heat radiation member has an isolation part extending between an outer circumference of the semiconductor element and the electronic part.

1 . A semiconductor device comprising:
 a semiconductor element mounted on a substrate;   at least one electronic part arranged around the semiconductor element; and   a heat radiation member bonded to a backside of said semiconductor element by a bonding material,   wherein the heat radiation member has an isolation part extending between an outer circumference of said semiconductor element and said electronic part.   
     
     
         2 . The semiconductor device as claimed in  claim 1 , wherein said isolation part is formed integrally with said heat radiation member, and formed in a frame shape so as to surround an entire circumference of said semiconductor element. 
     
     
         3 . The semiconductor device as claimed in  claim 2 , wherein said bonding material is a metal bonding material, which joins said backside of said semiconductor element to said heat radiation member by being melted by heat and thereafter solidified, and is arranged inside said frame-shaped isolation part. 
     
     
         4 . The semiconductor device as claimed in  claim 3 , wherein said heat radiation member and said isolation part are formed by a material having a wetting characteristic to said metal bonding material. 
     
     
         5 . The semiconductor device as claimed in  claim 3 , wherein said metal bonding material is one of a solder and a silver paste. 
     
     
         6 . The semiconductor device as claimed in  claim 2 , wherein said heat radiation member has a concavity accommodating said semiconductor element and said electronic part, a peripheral part of the concavity being bonded to said substrate, and said isolation part extends toward said substrate from said heat radiation member, and a predetermined air gap is formed between an extreme end of said isolation part and said substrate. 
     
     
         7 . The semiconductor device as claimed in  claim 1 , wherein said isolation part is a member different from said heat radiation part and attached to said heat radiation member, and is formed in a frame shape so as to surround an entire circumference of said semiconductor element. 
     
     
         8 . The semiconductor device as claimed in  claim 7 , wherein said heat radiation member has a concavity accommodating said semiconductor element and said electronic part, and said isolation part is formed by bending a metal plate and fitted into the concavity of said heat radiation member. 
     
     
         9 . The semiconductor device as claimed in  claim 7 , wherein said bonding material is a metal bonding material, which joins said backside of said semiconductor element to said heat radiation member by being melted by heat and thereafter solidified, and is arranged inside said frame-shaped isolation part. 
     
     
         10 . The semiconductor device as claimed in  claim 8 , wherein said isolation part is formed by a material having a wetting characteristic to said metal bonding material. 
     
     
         11 . The semiconductor device as claimed in  claim 7 , wherein said metal bonding material is one of a solder and a silver paste. 
     
     
         12 . The semiconductor device as claimed in  claim 7 , wherein a peripheral part of said concavity of said heat radiation member is bonded to said substrate, and said isolation part extends toward said substrate from said heat radiation member, and a predetermined air gap is formed between an extreme end of said isolation part and said substrate. 
     
     
         13 . A heat radiation member configured and arranged to be bonded by a bonding material to a backside of a semiconductor element around which at least one electronic part is arranged, the heat radiation member including an isolation part formed to extend between an outer circumference of said semiconductor element and said electronic part. 
     
     
         14 . The heat radiation member as claimed in  claim 13 , including a concavity accommodating said semiconductor element and said electronic part, wherein said isolation part is a frame-shaped member having a size larger than an outer configuration of said semiconductor element. 
     
     
         15 . The heat radiation member as claimed in  claim 14 , wherein an extreme end of said isolation member is lower than a height of a peripheral part of said concavity from a bottom part of said heat radiation member. 
     
     
         16 . The heat radiation member as claimed in  claim 14 , wherein said isolation part is formed by bending a metal plate, and is fixed to said concavity by being fitted therein.