Electrical connection for optoelectronic devices

Abstract

A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

1 - 14 . (canceled)  
   
   
       15 . A device, comprising: 
 an active element on a first substrate;    a second substrate;    a bonding pad on one of the first and second substrates;    an attachment mechanism adapted to secure the first substrate and the second substrate in a vertical direction, a portion of the first and second substrates having the bonding pad thereon extending further in at least one direction than the other substrate; and    an electrical interconnection extending from the active element to the bonding pad.    
   
   
       16 . The device of  claim 15 , further comprising a spacer between the first and second substrates.  
   
   
       17 . The device of  claim 16 , wherein the spacer is formed in a spacer substrate.  
   
   
       18 . The device of  claim 17 , wherein the first and second substrates are attached via the spacer substrate.  
   
   
       19 . (canceled)  
   
   
       20 . The device of  claim 15 , wherein the electrical bonding pad is on the first substrate.  
   
   
       21 . The device of  claim 15 , wherein the bonding pad is on the second substrate.  
   
   
       22 . The device of  claim 21 , further comprising an electrically conductive material between the first and second substrates.  
   
   
       23 . The device of  claim 22 , wherein the electrically conductive material includes solder balls.  
   
   
       24 . The device of  claim 22 , wherein the electrically conductive material is on an element between the first and second substrates.  
   
   
       25 . The device of  claim 30 , wherein the feature is an optical element.  
   
   
       26 . The device of  claim 30 , wherein the feature is a hole.  
   
   
       27 . The device of  claim 30 , wherein the feature is an indentation.  
   
   
       28 .- 29 . (canceled)  
   
   
       30 . The device of  claim 15 , further comprising a feature on the second substrate.  
   
   
       31 . The device of  claim 30 , wherein the feature is on a surface of the second substrate facing the first substrate.  
   
   
       32 . The device of  claim 30 , wherein the feature is on an upper surface of the second substrate facing the first substrate.  
   
   
       33 . The device of  claim 16 , wherein sidewalls of the spacer facing the active element are beveled.  
   
   
       34 . The device of  claim 15 , wherein the attachment mechanism and the second substrate seal the active element.  
   
   
       35 . The device of  claim 34 , wherein the seal is hermetic.  
   
   
       36 . The device of  claim 15 , wherein the attachment mechanism includes electrically conductive material.  
   
   
       37 . The device of  claim 36 , wherein the electrically conductive material includes solder balls.