Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns

Abstract

Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

1 . A method of forming a three-dimensional structure from a molding material, comprising: 
 (A) providing a mold having a mold structure that comprises at least one metal mold material, the at least one metal mold material having a surface that defines a desired molding pattern, wherein the mold structure is formed, at least in part, by electrochemically fabricating multiple layers, each comprising the at least one metal mold material deposited adjacent to and adhered to a previously deposited layer that comprises the at least one metal mold material;    (B) placing flowable molding material against the desired molding pattern and allowing or causing the molding material to solidify to form at least a portion of the three-dimensional structure; and    (C) separating the three-dimensional structure from the mold, wherein the separating is accomplished, at least in part, by destroying the desired molding pattern defined by the metal mold material without significantly damaging the molding material such that an image of the molding pattern remains on a surface of the three-dimensional structure.    
     
     
         2 . The method of  claim 1  wherein the electrochemically fabricating multiple layers comprises: 
 (D) depositing at least one support material during formation of a given layer;    (E) depositing the at least one metal mold material during the formation of the given layer; and    (F) repeating the depositing of the at least one support material and the at least one metal mold material during formation of a plurality of the multiple layers that are each adhered to a previously deposited layer; and    (G) after formation of the plurality of the multiple layers, removing the at least one support material from the at least one metal mold material thereby substantially yielding at least a portion of the desired molding pattern,    wherein the depositing of the at least one support material or the at least one metal mold material comprises and electrochemical deposition.    
     
     
         3 . The method of  claim 2  wherein the depositing of at least one of (1) the at least one support material or (2) the at least one metal mold material, comprises a selective electroplating through a patterned mask that is placed in contact with or in proximity to a surface onto which deposition is to occur.  
     
     
         4 . The method of  claim 2  wherein the depositing of at least one of (1) the at least one support material or (2) the at least one metal mold material, comprises a selective electroplating through a mask that is adhered to a surface onto which deposition is to occur.  
     
     
         5 . The method of  claim 2  wherein depositing of the at least one support material or the depositing of the at least one metal mold material for the given layer comprises a selective deposition of at least one of the at least one support material or at least one of the at least one metal mold material.  
     
     
         6 . The method of  claim 5  wherein the formation of the given layer further comprises the removal of deposited material that extends beyond a boundary plane of the given layer.  
     
     
         7 . The method of  claim 1  wherein the desired molding pattern comprises at least one structural material of a desired configuration, wherein the structural material is deposited by electrochemical deposition during the formation of at least one of the multiple layers.  
     
     
         8 . The method of  claim 1  wherein at least a portion of the molding pattern defined by the at least one metal mold material defines passages or cavities within the molding material from which removal of the at least one metal mold material would be impossible except for the destruction of either the molding pattern or the three-dimensional structure.  
     
     
         9 . The method of  claim 8  wherein at least a portion of the passages or cavities when considered alone or in combination with other passages or cavities comprise re-entrant elements.  
     
     
         10 . The method of  claim 1  wherein the destroying of the desired molding pattern comprises selective chemical etching of at least a portion of the at least one metal mold material.  
     
     
         11 . The method of  claim 1  wherein the separating of the three-dimensional structure the mold comprises electrochemical etching of at least a portion of the at least one metal mold material so as to destroy the desired molding pattern.  
     
     
         12 . The method of  claim 1  wherein the destroying of the desired molding pattern comprises melting of at least a portion of the at least one metal mold material.  
     
     
         13 . The method of  claim 1  wherein substantially the entire surface of the mold, with the exception of any structural components that will remain within or bonded to the molding material, is formed of the at least one metal mold material.  
     
     
         14 . The method of  claim 1  wherein the mold comprises a portion formed of the at least one metal mold material and another portion formed from a material having a reusable configuration.  
     
     
         15 . The method of  claim 1  wherein the placing of flowable molding material against the desired molding pattern occurs with the aid of a vacuum.  
     
     
         16 . The method of  claim 1  wherein the placing of flowable molding material against the desired molding pattern occurs with the flowable molding material being subjected to pressure.  
     
     
         17 . The method of  claim 1  wherein the destroying of the desired molding pattern occurs with the aid of a vacuum.  
     
     
         18 . The method of  claim 1  wherein the destroying of the desired molding pattern occurs with the aid of pressurized liquid or gas.  
     
     
         19 . The method of  claim 1  wherein the three-dimensional structure comprises a valve.  
     
     
         20 . The method of  claim 19  wherein the valve comprises a check valve.  
     
     
         21 . The method of  claim 20  wherein the valve is pneumatically or hydraulically driven.  
     
     
         22 . The method of  claim 21  wherein the valve is driven by a bellows that is magnetically or electrically driven.  
     
     
         23 . The method of  claim 20  wherein the valve is magnetically or electrically driven and wherein at least a portion of at least one magnetic or electrical component internal to the three-dimensional structure was formed by electrochemical deposition in conjunction with formation of the molding pattern.  
     
     
         24 . The method of  claim 1  wherein the three-dimensional structure comprises a pump.  
     
     
         25 . The method of  claim 24  wherein the pump is a peristaltic pump comprised of a series of diaphragm structures.  
     
     
         26 . The method of  claim 1  wherein the three-dimensional structure comprises a manifold.  
     
     
         27 . The method of  claim 26  wherein flow through the manifold is controlled by a combination of pumps and valves.  
     
     
         28 . The method of  claim 27  wherein the manifold is used to mix different fluids in desired combinations.  
     
     
         29 . The method of  claim 1  wherein the molding material comprises a thermal plastic material.  
     
     
         30 . The method of  claim 1  wherein the molding material comprises a thermoplastic material.  
     
     
         31 . The method of  claim 1  wherein the molding material comprises an elastomeric material.  
     
     
         32 . The method of  claim 1  wherein the at least one metal mold material comprises copper.  
     
     
         33 . The method of  claim 1  wherein the at least one metal mold material comprises nickel.  
     
     
         34 . The method of  claim 1  wherein the at least one metal mold material defining the molding pattern comprises design features smaller than about 100 um.  
     
     
         35 . A method of forming a three-dimensional structure from a molding material, comprising: 
 (A) providing a mold having a mold structure that comprises at least one mold material, the at least one mold material having a surface that defines a desired molding pattern, wherein the mold structure is formed, at least in part, by depositing multiple layers, each comprising the at least one mold material deposited adjacent to and adhered to a previously deposited material that comprises the at least one mold material, and wherein at least a portion of some layers were formed via an electrodeposition of a conductive material;    (B) placing flowable molding material against the desired molding pattern and allowing or causing the molding material to solidify to form at least a portion of the three-dimensional structure; and    (C) separating the three-dimensional structure from the mold, wherein the separating is accomplished, at least in part, by destroying the desired molding pattern defined by the mold material without significantly damaging the molding material such that an image of the molding pattern remains on a surface of the three-dimensional structure.    
     
     
         36 . A method of forming a three-dimensional structure from a molding material, comprising: 
 (A) forming a desired molding pattern from at least one mold material, at least in part, by an electrochemical fabrication process comprising: 
 forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously formed layer, wherein said forming comprises a plurality of selective depositing operations which comprise:  
 a. locating or forming a mask, having at least one opening, on a plating surface, comprising a previously deposited material, a portion of which is to receive a deposition;  
 b. in presence of a plating solution, conducting an electric current through the at least one opening in the mask between an anode and the plating surface, wherein the plating surface functions as a cathode, such that a selected deposition material is deposited onto the plating surface to form at least a portion of a layer; and  
 c. separating the mask from the plating surface;  
   (B) filling the molding pattern with flowable molding material and allowing or causing the molding material to solidify to form the three-dimensional structure; and    (C) separating the three-dimensional structure from the mold, wherein the separating is accomplished, at least in part, by destroying the molding pattern without significantly damaging the molding material and removing any residual mold material from the three-dimensional structure such that an image of the molding pattern remains on a surface of the three-dimensional structure.    
     
     
         37 . The method of  claim 36  additionally comprising: 
 supplying a plurality of preformed masks, wherein each mask comprises a patterned conformable dielectric material that includes at least one opening through which a deposition can take place during the formation of at least a portion of a layer, and wherein each mask comprises a support structure that supports the patterned conformable dielectric material; and    wherein the locating or forming a mask comprises contacting a selected preformed mask to the plating surface.    
     
     
         38 . The method of  claim 36  wherein the locating or forming a mask comprises forming and adhering a patterned mask to the plating surface.