Sealing compositions

Abstract

The present invention is a composition that may be used for sealing applications in the manufacture of electronic devices. The composition includes organic vehicles that may be removed upon low temperature firing in air or inert atmospheres. The present invention is further a process for the use of the composition.

1 . A composition of matter comprising, in admixture, (a) glass frit, (b) a solvent, and (c) an organic vehicle selected from one or more members of the group consisting of a polystyrene, a polyolefin, a polyacrylate, a polyester, a polycarbonate, a polyol, a polyether, a polyacetal and a polyamide; wherein the organic vehicle has a molecular weight in the range of about 200 to about 1000.  
   
   
       2 . A composition according to  claim 1  wherein the organic vehicle is a poly(alpha-methylstyrene).  
   
   
       3 . A composition according to  claim 1  wherein the organic vehicle is a butylated poly(alpha-methylstyrene).  
   
   
       4 . A composition according to  claim 1  wherein the organic vehicle is derived from a methylmethacrylate.  
   
   
       5 . A composition according to  claim 1  further comprising a filler.  
   
   
       6 . A composition according to  claim 1  wherein the median particle size of the glass frit is in the range of about 1 to about 100 microns.  
   
   
       7 . A field emission device comprising a composition according to  claim 1 .  
   
   
       8 . A field emission device according to  claim 7  comprising carbon nanotubes.  
   
   
       9 . A field emission display comprising a field emission device according to  claim 7 .  
   
   
       10 . A lighting device comprising a field emission device according to  claim 7 .  
   
   
       11 . A sealing process comprising (a) depositing a bead or patterned layer of the composition of  claim 1  on a substrate, (b) volatilizing the solvent and/or organic vehicle, and (c) firing the bead or patterned layer.  
   
   
       12 . A sealing process comprising (a) depositing a bead or patterned layer of the composition of  claim 1  on a first substrate, (b) volatilizing the solvent and/or organic vehicle, (c) bringing a second substrate into contact with the bead or patterned layer, and (d) firing the bead or patterned layer.  
   
   
       13 . A process according to  claim 11  wherein the firing is in a nitrogen or other inert atmosphere.  
   
   
       14 . A process according to  claim 11  wherein the firing temperature is about 430° C. or lower.  
   
   
       15 . A process according to  claim 11  wherein the firing temperature is in the range of about 280° C. to about 400° C. or lower.  
   
   
       16 . A process according to  claim 12  wherein the firing is in a nitrogen or other inert atmosphere.  
   
   
       17 . A process according to  claim 12  wherein the firing temperature is about 430° C. or lower.  
   
   
       18 . A process according to  claim 12  wherein the firing temperature is in the range of about 280° C. to about 400° C. or lower.  
   
   
       19 . A process according to  claim 11  wherein the substrate comprises electronic device elements.  
   
   
       20 . A process according to  claim 12  wherein the first and/or second substrates comprise electronic device elements.