Polishing pad and forming method

Abstract

A polishing pad which ensures that a work can be easily removed from the polishing pad surface after polishing, the amount of a polishing liquid used for polishing can be reduced, and the production cost of the polishing pad can be lowered. A first polishing pad ( 1 ) for polishing a work is provided with a plurality of slots ( 11 ) piercing the first polishing pad ( 1 ) in a sa direction, the length in the longitudinal direction of the slots ( 11 ) being preferably not less than 20 mm, the pitch in the width direction of the slots ( 11 ) being preferably less than 100 mm, and small holes (not shown) may be provided in addition to the slots ( 11 ).

1 - 18 . (canceled)  
     
     
         19 . A method of forming a polishing pad for polishing a surface of a material to be polished, comprising: 
 providing a polishing pad; and    forming slots in the polishing pad which extend through the entire thickness of said polishing pad in the thickness direction such that the slot opening on one surface of the pad is substantially the same size and shape as the slot opening on the opposing surface of the pad, and wherein the slots do not extend to an outer circumferential surface of the pad.    
     
     
         20 . A method of forming a polishing pad for polishing a surface of a material to be polished, comprising: 
 providing a polishing pad; and    forming holes in the polishing pad which extend through the entire thickness of said polishing pad in the thickness direction, part of said plurality of holes being composed of slots and wherein the slots do not extend to an outer circumferential surface of the pad, and wherein each slot opening on one surface of the pad is substantially the same size and shape as the slot opening on the opposing surface of the pad.    
     
     
         21 . A method of forming a polishing pad as set forth in  claim 20 , wherein the holes and the slots do not overlap.  
     
     
         22 . A method of forming a polishing pad as set forth in  claim 19 , wherein the formation of the slots in the polishing pad is comprised of punching the slots into the polishing pad.  
     
     
         23 . A method of forming a polishing pad as set forth in  claim 20 , wherein the formation of the slots in the polishing pad is comprised of punching the slots into the polishing pad.