Wafer carrying apparatus

Abstract

A wafer carrying apparatus disposed in a dry etching chamber is provided. The wafer carrying apparatus comprises at least an insulation plate, a conductive element and an insulation ring. The insulation plate has a cavity and a protruding portion surrounding the cavity. The conductive element is disposed in the cavity. The insulation ring covers at least the exposed top surface of the protruding portion.

1 . A wafer carrying apparatus, disposed in a dry etching chamber to carry a wafer, wherein the wafer carrying apparatus at least comprises: 
 an insulation plate, having a cavity and a protruding portion surrounding the cavity;    a conductive element, disposed in the cavity; and    an insulation ring, covering at least a top surface of the protruding portion.    
   
   
       2 . The wafer carrying apparatus as claimed in  claim 1 , wherein a surface of the insulation ring is a flat surface.  
   
   
       3 . The wafer carrying apparatus as claimed in  claim 1 , wherein the wafer is disposed on the insulation ring, and an inner diameter of the insulation ring is not greater than a diameter of the wafer.  
   
   
       4 . The wafer carrying apparatus as claimed in  claim 1 , wherein a top surface of the conductive element is higher than a top of the insulation plate, and the top surface of the conductive element is not higher than a top surface of the insulation ring.  
   
   
       5 . The wafer carrying apparatus as claimed in  claim 1 , wherein the insulation ring surrounds the conductive element.  
   
   
       6 . The wafer carrying apparatus as claimed in  claim 1 , wherein a material of the insulation ring and the insulation plate includes ceramic.  
   
   
       7 . The wafer carrying apparatus as claimed in  claim 1 , wherein a material of the conductive element includes titanium.  
   
   
       8 . The wafer carrying apparatus as claimed in  claim 1 , wherein the conductive element comprises a pedestal and a shield above the pedestal.  
   
   
       9 . The wafer carrying apparatus as claimed in  claim 8 , wherein a material of the pedestal includes titanium.  
   
   
       10 . The wafer carrying apparatus as claimed in  claim 8 , wherein a material of the shield includes stainless steel.  
   
   
       11 . The wafer carrying apparatus as claimed in  claim 1 , wherein a material of the insulation plate includes ceramic.