US2007181064A1PendingUtilityA1

Plasma source assembly and method of manufacture

Assignee: TOKYO ELECTRON LTDPriority: Jun 24, 2002Filed: Oct 19, 2006Published: Aug 9, 2007
Est. expiryJun 24, 2022(expired)· nominal 20-yr term from priority
Inventors:Steven Fink
H01J 37/321
57
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A plasma source assembly including an outer shield, a dielectric chamber wall, and a helical coil provided between the outer shield and the dielectric chamber wall. The plasma source assembly also includes a coil support assembly configured to facilitate repeatable performance of the helical coil. Preferably, the assembly includes a plenum cooling plate that is configured to supply cooling fluid to a first cooling rod provided within a resonator cavity defined by the chamber wall and the outer shield, and receive cooling fluid from a second cooling rod provided within the resonator cavity. The assembly preferably also includes a spacer provided between the first cooling rod and the second cooling rod, and coil insulators having holes configured to receive the helical coil.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a plasma processing system, said method comprising the steps of: 
 providing a process chamber;    providing a chuck assembly within the process chamber;    providing a gas inject assembly opposite the chuck assembly; and    mounting the gas inject assembly to the process chamber using an outer shield, the outer shield comprising a plurality of plates.    
   
   
       2 . The method according to  claim 1 , wherein the plurality of plates are stacked and detachably joined to one another, and further comprising the step of providing at least one sealing member between adjacent plates of the plurality of plates.  
   
   
       3 . The method according to  claim 1 , further comprising the steps of: 
 providing a dielectric chamber wall, wherein the dielectric chamber wall and the plurality of plates define a resonator cavity; and    providing a helical coil within the resonator cavity.    
   
   
       4 . The method according to  claim 3 , further comprising the step of tuning the helical coil to a predetermined frequency.  
   
   
       5 . The method according to  claim 3 , further comprising the steps of: 
 attaching a brass plug to the resonator cavity using a high temperature soldering process; and    attaching the brass plug to the helical coil using a low temperature soldering process.    
   
   
       6 . The method according to  claim 3 , further comprising the step of providing a plenum cooling plate defining a manifold configured to supply cooling fluid to the resonator cavity and the gas inject assembly.  
   
   
       7 . The method according to  claim 6 , further comprising the step of providing the gas inject assembly between the dielectric chamber wall and the plenum cooling plate.  
   
   
       8 . The method according to  claim 6 , further comprising the steps of: 
 providing a first cooling rod within the resonator cavity radially outside the helical coil;    supplying cooling fluid to the first cooling rod via the plenum cooling plate;    providing an outlet hole on the first cooling rod that is configured to discharge the cooling fluid in a circumferential direction within the resonator cavity;    providing a second cooling rod within the resonator cavity radially inside the helical coil; and    receiving cooling fluid in the plenum cooling plate via the second cooling rod.    
   
   
       9 . A method of manufacturing a plasma source assembly, said method comprising the steps of: 
 providing an outer shield;    providing a dielectric chamber wall; and    mounting a helical coil between the outer shield and the dielectric chamber wall using a coil support means for facilitating repeatable performance of the helical coil.    
   
   
       10 . The method according to  claim 9 , further comprising the step of tuning the helical coil to a predetermined frequency.  
   
   
       11 . The method according to  claim 9 , wherein the dielectric chamber wall and the plurality of plates define a resonator cavity, and wherein the helical coil is provided within the resonator cavity, further comprising the step of securing the helical coil within the resonator cavity.  
   
   
       12 . The method according to  claim 11 , further comprising the step of supplying cooling fluid to the resonator cavity using a plenum cooling plate defining a manifold.  
   
   
       13 . The method according to  claim 12 , wherein: 
 the plenum cooling plate is configured to supply cooling fluid to a first cooling rod provided within the resonator cavity;    the first cooling rod is provided radially outside the helical coil; and    the first cooling rod has at least one outlet hole configured to discharge the cooling fluid in a circumferential direction within the resonator cavity.    
   
   
       14 . The method according to  claim 13 , wherein: 
 the plenum cooling plate is configured to receive cooling fluid from a second cooling rod provided within the resonator cavity;    the second cooling rod is provided radially inside the helical coil; and    the second cooling rod has at least one inlet hole configured to receive the cooling fluid from within the resonator cavity.    
   
   
       15 . The method according to  claim 14 , further comprising the steps of: 
 providing a spacer between the first cooling rod and the second cooling rod; and    providing coil insulators abutting the spacer and between the first cooling rod and the second cooling rod, wherein the coil insulators have holes configured to receive the helical coil.

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