Planarization for Integrated Circuits

Abstract

A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.

1 . A method of providing a planarized layer of an integrated circuit, comprising: 
 depositing a layer as a liquid film by means of extrusion;    forming a recess in the layer; and    forming a conductor within the recess in the layer.    
   
   
       2 . The method of  claim 1  and further comprising curing the liquid film by performing a thermal step.  
   
   
       3 . The method of  claim 1  and further comprising curing the liquid by performing a photochemical step.  
   
   
       4 . The method of  claim 1  wherein the substantially planar surface is planarized to less than 250 angstroms.  
   
   
       5 . The method of  claim 1  wherein forming a recess in the layer comprises removing a sacrificial material.