Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device equipped with the same

Abstract

A wafer holder uniformly heats a wafer at high temperatures without being damaged. A semiconductor manufacturing apparatus is provided with this wafer holder. The contact surface area where the wafer and the wafer mounting surface of the wafer-holding part are in contact includes a contact surface area A in an outer circumferential area that is farther than 1/√2R from the center of the wafer, where R is the radius of the wafer, and a contact surface area B in an inner circumferential area that is within 1/√2R of the center. The contact surface area is established so that A>B. In order to obtain this relationship, the wafer-contacting part of the wafer mounting surface is preferably formed into annular convexities or embossed convexities.

1 . A wafer holder for a semiconductor manufacturing apparatus including a resistance heater, the wafer holder comprising: 
 a wafer holding part having a wafer mounting surface configured and arranged to support a wafer such that a surface area of contact between the wafer and the wafer mounting surface satisfies the relation A>B, where    A is a contact surface area in an outer circumferential area that is farther than 1/√2R from a center of the wafer,    R is the radius of the wafer, and    B is a contact surface area in an inner circumferential area that is within 1/√2R of the center of the wafer.    
   
   
       2 . The wafer holder for a semiconductor manufacturing apparatus according to  claim 1 , wherein 
 the contact surface area between the wafer and the wafer mounting surface is established so that A>2B.    
   
   
       3 . The wafer holder for a semiconductor manufacturing apparatus according to  claim 1 , wherein 
 the contact surface area between the wafer and the wafer mounting surface is established so that B=0.    
   
   
       4 . The wafer holder for a semiconductor manufacturing apparatus according to  claim 1 , wherein 
 the wafer mounting surface has a wafer-contacting part that is shaped as an annular convexity.    
   
   
       5 . The wafer holder for a semiconductor manufacturing apparatus according to  claim 1 , wherein 
 the wafer mounting surface has a wafer-contacting part that is shaped as an embossed convexity.    
   
   
       6 . The wafer holder for a semiconductor manufacturing apparatus according to  claim 1 , further comprising 
 a support member configured and arranged to support the wafer-holding part, wherein    the support member is physically anchored or chemically joined to the wafer-holding part.    
   
   
       7 . A semiconductor manufacturing apparatus comprising the wafer holder of  claim 1.