Wafer Handler Method and System

Abstract

Systems and methods for handling wafers include retrieving a first wafer from a wafer cassette using a first arm, transferring the first wafer from the first transfer arm to a second arm, delivering the first wafer for processing to a process chamber using the second arm, removing the first wafer from the process chamber using the first arm, and returning the first wafer to the cassette using the first arm. The systems and methods can include retrieving a first wafer from a wafer cassette using a first arm, delivering the first wafer for processing to a process chamber using the first arm, removing a processed wafer from the process chamber using a second arm, returning the processed wafer to the cassette using the second arm, and iteratively retrieving, delivering, removing and returning wafers from the cassette while alternating arms between iterations.

1 . A system for handling wafers, the system comprising: 
 a first arm for handling wafers,    a distinct second arm for handling wafers,    a first cassette of wafers, and,    a wafer processing system,    where wafers are delivered to the processing system from the first cassette using the first arm and the second arm, and where the delivery includes, 
 individually retrieving a first wafer from the cassette using the first arm,  
 transferring the first wafer from the first arm to the second arm,  
 delivering the first wafer for processing by the wafer processing system using the second arm,  
 processing the first wafer to generate a processed wafer, while retrieving a next wafer from the cassette using the first arm,  
 transferring the next wafer to the second arm,  
 removing the processed wafer using the first arm and delivering the next wafer for processing using the second arm,  
 processing the next wafer to generate a processed wafer while returning the processed wafer to the cassette, and  
 iteratively performing the processing, transferring, removing, and processing to process the wafers in the cassette.  
   
   
   
       2 . A system according to claim  51 , further including a first load lock for the first cassette.  
   
   
       3 . A system according to claim  51 , further including an orienter for orienting the wafers before processing and transferring the wafers between the first arm and the second arm.  
   
   
       4 . A system according to claim  51 , further including a platen for retrieving wafers from the second arm for delivering the wafers, and transferring processed wafers to the first arm for removing the processed wafers.  
   
   
       5 . A system for handling wafers, the system comprising: 
 a first arm for handling wafers,    a distinct second arm for handling wafers,    a first cassette of wafers, and,    a wafer processing system,    where wafers are delivered to the processing system from the first cassette using the first arm and the second arm, and where the delivery includes, 
 individually retrieving a first wafer from the cassette using the first arm,  
 delivering the first wafer for processing by the wafer processing system using the first arm,  
 returning a processed wafer to the cassette using a second arm while processing the first wafer to generate a processed wafer,  
 retrieving a next wafer from the cassette using the second arm,  
 removing the processed wafer using the first arm and delivering the next wafer for processing using the second arm,  
 processing the next wafer to generate a processed wafer while returning the processed wafer to the cassette, and  
 iteratively performing the retrieving, delivering, returning, retrieving, removing, and processing to process the wafers in the cassette.  
   
   
   
       6 . A system according to claim  55 , further including a first load lock for the first cassette.  
   
   
       7 . A system according to claim  55 , further including an orienter for orienting the wafers before processing.  
   
   
       8 . A system according to claim  55 , further including a platen for retrieving wafers from the first and second arms for processing the wafers, and transferring processed wafers to the first and second arms for removing the processed wafers.  
   
   
       9 . A system according to claim  55 , further including at least one carriage for moving the first and second arms relative to the cassette for returning and retrieving wafers from the cassette.