Methods for fabricating stiffeners for flexible substrates

Abstract

Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiffeners may be formed by selectively depositing or consolidating unconsolidated material. They may include a plurality of mutually adhered regions. The stiffeners may be configured to prevent torsional flexion or bending of the connective structure to which they are to be secured, to reinforce sprocket or indexing holes in connective structures or to include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude.

1 . A method of fabricating at least one element of a stiffener for a connective structure to be tape-automated bonded to a semiconductor device component, comprising forming at least one layer of the stiffener over a platform of a programmable material consolidation apparatus.  
   
   
       2 . The method of  claim 1 , wherein forming comprises forming the at least one layer from a photopolymer.  
   
   
       3 . The method of  claim 1 , wherein forming is effected on the connective structure.  
   
   
       4 . The method of  claim 1 , wherein forming is effected on a strip comprising a plurality of connective structures to be tape-automated bonded to semiconductor device components.  
   
   
       5 . A method of fabricating at least an element of a stiffener for a connective structure to be tape-automated bonded to a semiconductor device component, comprising: placing at least one connective structure in a substantially horizontal plane; recognizing a location and orientation of the at least one connective structure; and fabricating at least a portion of at least the element of the stiffener comprising at least partially consolidated material on a surface of the at least one connective structure in accordance with a program.  
   
   
       6 . The method of  claim 5 , further comprising storing data including at least one physical parameter of the at least one connective structure and of at least the element of the stiffener in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the at least one connective structure.  
   
   
       7 . The method of  claim 6 , further including storing in computer memory at least one physical parameter of at least one feature of the at least one connective structure around which the at least one element of the stiffener is to be fabricated.  
   
   
       8 . The method of  claim 6 , further including storing in computer memory at least one parameter of another semiconductor device component with which the at least one connective structure is to be assembled.  
   
   
       9 . The method of  claim 6 , further comprising using the stored data, in conjunction with the machine vision system, to effect fabricating at least one layer of the at least one element of the stiffener.  
   
   
       10 . The method of  claim 6 , further comprising recognizing a location of at least one feature of the at least one connective structure.  
   
   
       11 . The method of  claim 5 , further including securing the at least one connective structure to a carrier prior to placing the at least one connective structure in the substantially horizontal plane.  
   
   
       12 . The method of  claim 5 , wherein fabricating comprises stereolithographically fabricating at least the portion.