US2007170467A1PendingUtilityA1

Semiconductor device

Assignee: TANI KOUICHIPriority: Jul 1, 2004Filed: Mar 29, 2007Published: Jul 26, 2007
Est. expiryJul 1, 2024(expired)· nominal 20-yr term from priority
Inventors:Kouichi Tani
H10D 84/811H10D 84/0144H10D 84/038H10D 1/64H03L 7/099
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Claims

Abstract

A semiconductor device includes a first transistor having a first gate oxide layer with a first thickness; a second transistor having a second gate oxide layer with a second thickness different from the first thickness; and at least one of a capacitor and a variable capacitance diode. The one of the capacitor and the variable capacitance diode includes a first electrode formed in a first area and a second area, a second electrode formed in the first area with the first gate oxide layer inbetween, and a third electrode formed in the second area with the second gate oxide layer inbetween.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising: 
 a first transistor having a first gate oxide layer with a first thickness;    a second transistor having a second gate oxide layer with a second thickness different from the first thickness; and    at least one of a capacitor and a variable capacitance diode, said one of the capacitor and the variable capacitance diode including a first electrode formed in a first area and a second area, a second electrode formed in the first area with the first gate oxide layer inbetween, and a third electrode formed in the second area with the second gate oxide layer inbetween.    
     
     
         2 . The semiconductor device according to  claim 1 , wherein said second electrode has a first comb shape, said third electrode having a second comb shape nested inside one another with the first comb shape.  
     
     
         3 . The semiconductor device according to  claim 1 , further comprising a semiconductor substrate having the first area, the second area, and the third area.  
     
     
         4 . The semiconductor device according to  claim 3 , wherein said semiconductor substrate has the second area disposed adjacent to the first area, said third area being disposed adjacent to the first area on a side opposite to the second area.  
     
     
         5 . The semiconductor device according to  claim 3 , wherein said semiconductor substrate includes one of a silicon substrate, a silicon-on-insulator substrate, and a silicon-on-sapphire substrate.

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