Package for mounting an optical element and a method of manufacturing the same

Abstract

The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of silicon. A method of manufacturing the package of the present invention is featured by mounting the silicon wafer on the insulating substrate.

1 . A package for mounting an optical element comprising a frame made of single crystal silicon and having a window for mounting the optical element thereon and an insulating substrate being bonded to the frame and having a linear thermal expansion coefficient close to that of the frame, wherein the insulating substrate has an input/output terminal on one face and an input/output pad on the other face, the terminal and the pad being electrically connected by means of a conductor formed in a through-hole in the insulating substrate and the input/output terminal being arranged within an area of the window.  
   
   
       2 . A package for mounting an optical element comprising a frame made of single crystal silicon and having a window for mounting the optical element thereon and an insulating substrate being bonded to the frame and having a linear thermal expansion coefficient close to that of the frame, wherein the insulating substrate has a metalizing film on both faces and side face of the substrate, the metalizing film electrically connecting the input/output terminals formed on one face of the substrate and input/output pads formed on the other face of the substrate and the input/output terminal being arranged within an area of the window.  
   
   
       3 . The package according to  claim 1 , wherein the window of the frame has oblique faces where the optical element is mounted, each of the oblique faces outwardly spreading with respect to the center axis of the window.  
   
   
       4 . The package according to  claim 2 , wherein the window of the frame has oblique faces where the optical element is mounted, each of the oblique faces outwardly spreading with respect to the center axis of the window.  
   
   
       5 . A module comprising a frame of silicon single crystal having a window, an insulating substrate bonded to the frame and having a linear thermal expansion coefficient close to that of the frame, a light emitting diode, a photodiode, input/output terminals each being connected to each of the diodes, input/output pads each being connected to each of the diodes and an optical element mounted on the window, the element being located in optical relation with the diodes.  
   
   
       6 . A package array constituted by a number of packages each being defined in  claim 1 .  
   
   
       7 . A module array constituted by a number of modules each being defined in  claim 4.