Mask for exposure

Abstract

In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

1 - 10 . (canceled)  
     
     
         11 . A mask for exposure used in a photoetching process, comprising: 
 a sheet-like mask body; and    a plurality of pattern holes formed in the mask body,    wherein a group of pattern holes corresponding to wiring patterns of individual layers of a multilayer flexible wiring board are directly arranged in width direction of the mask body, and a plurality of the groups of the pattern holes corresponding to wiring patterns of the individual layers of multilayer flexible wiring boards are arranged in a direction perpendicular to the width direction of the mask body.    
     
     
         12 . The mask of  claim 11 , wherein the plurality of the groups of the pattern holes corresponding to wiring patterns of the individual layers of the multilayer flexible wiring boards are directly arranged in a direction perpendicular to a transporting direction of a flexible board on which a predetermined wiring pattern is to be formed using the mask.