Light-emitting diode package structure

Abstract

A light-emitting diode package structure is provided. The light-emitting diode package comprises an insulating sub-mount, a first patterned conductive-reflective film, a second patterned conductive-reflective film and a light-emitting diode chip. The insulating sub-mount has a first surface and a cavity therein. The first and the second patterned conductive-reflective film are set over a portion of the first surface, a portion of the sidewalls of the cavity and a portion of the bottom surface of the cavity. The light-emitting diode chip is set up inside the cavity of the insulating sub-mount. The light-emitting diode has a pair of electrodes. The electrodes are electrically connected to the first and the second patterned conductive-reflective film respectively. Since the light-emitting diode structure of this invention incorporates the patterned conductive-reflective films, efficiency of the light-emitting diode is increased.

1 . A light-emitting diode package structure, comprising: 
 an insulating sub-mount having a first surface with a cavity therein;    a first patterned conductive-reflective film set up on a portion of the first surface, a first sidewall of the cavity and a bottom surface of the cavity;    a second patterned conductive-reflective film set up on a portion of the first surface, a second sidewall of the cavity and a bottom surface of the cavity; and    a light-emitting diode chip set up inside the cavity of the insulating sub-mount, wherein the light-emitting diode has a first electrode and a second electrode electrically connected to the first patterned conductive-reflective film and the second patterned conductive-reflective film.    
   
   
       2 . The light-emitting diode package structure of  claim 1 , wherein the package further comprises a pair of bumps set up between the first electrode of the light-emitting diode and the first patterned conductive-reflective film as well as the second electrode of the light-emitting diode and the second patterned conductive-reflective film.  
   
   
       3 . The light-emitting diode package structure of  claim 2 , wherein material constituting the bumps comprises lead-tin or Au—Sn alloy or Au.  
   
   
       4 . The light-emitting diode package structure of  claim 1 , wherein material constituting the insulating sub-mount is selected from a group consisting of aluminum nitride, silicon, GaAs, SiC, boron nitride, beryllium oxide and zinc oxide.  
   
   
       5 . The light-emitting diode package structure of  claim 1 , wherein the package further comprises a first bonding pad and a second bonding pad set up on the first patterned conductive-reflective film and the second patterned conductive-reflective film for connecting electrically with an external circuit board.  
   
   
       6 . The light-emitting diode package structure of  claim 1 , wherein the sidewall and the bottom surface of the cavity form an obtuse angle.  
   
   
       7 - 15 . (canceled)