Flexible circuits having ink-resistant covercoats

Abstract

A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.

1 . A circuit article for use with an inkjet printer pen, the circuit article comprising: 
 a flexible circuit having a plurality of conductive traces disposed on a dielectric film;    an adhesive film disposed adjacent the dielectric film of the flexible circuit, the adhesive film being derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent; and    a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit.    
     
     
         2 . The circuit article of  claim 1 , wherein the epoxidized aromatic-diene block copolymer comprises an epoxidized styrene-butadiene block copolymer.  
     
     
         3 . The circuit article of  claim 2 , wherein the epoxidized styrene-butadiene block copolymer comprises about 30% by weight to about 50% by weight epoxidized butadiene block.  
     
     
         4 . The circuit article of  claim 1 , wherein the epoxidized aromatic-diene block copolymer has an epoxy equivalent weight ranging from about 100 to about 1,300.  
     
     
         5 . The circuit article of  claim 1 , wherein the thermal-curing agent comprises a quaternary hexafluoroantimonate salt.  
     
     
         6 . The circuit article of  claim 1 , wherein the carrier film comprises a material selected from the group consisting of poly(ethylene naphthalate), poly(ethylene terephthalate, polyimides, and combinations thereof.  
     
     
         7 . The circuit article of  claim 1 , wherein the carrier film is treated with a treatment technique selected from the group consisting of flash lamp treatments, corona treatments, plasma treatments, flame treatments, chemical treatments, and combinations thereof.  
     
     
         8 . The circuit article of  claim 1 , further comprising an adhesive tie layer disposed adjacent the carrier film, opposite the adhesive film.  
     
     
         9 . An inkjet printer pen comprising: 
 a pen body configured to store and dispense ink;    a carrier film adhered to the pen body;    an adhesive film disposed adjacent the carrier film, opposite the body, wherein the adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent;    a flexible circuit having a plurality of conductive traces disposed on a dielectric film, the dielectric film being disposed adjacent the adhesive film.    
     
     
         10 . The inkjet printer pen of  claim 9 , wherein the epoxidized aromatic-diene block copolymer comprises an epoxidized styrene-butadiene block copolymer.  
     
     
         11 . The inkjet printer pen of  claim 9 , wherein the epoxidized aromatic-diene block copolymer has an epoxy equivalent weight ranging from about 100 to about 1,300.  
     
     
         12 . The inkjet printer pen of  claim 9 , wherein the thermal-curing agent comprises a quaternary hexafluoroantimonate salt.  
     
     
         13 . The inkjet printer pen of  claim 9 , wherein the carrier film comprises a material selected from the group consisting of poly(ethylene naphthalate), poly(ethylene terephthalate, polyimides, and combinations thereof.  
     
     
         14 . The inkjet printer pen of  claim 9 , wherein the carrier film is treated with a treatment technique selected from the group consisting of flash lamp treatments, corona treatments, plasma treatments, flame treatments, chemical treatments, and combinations thereof.  
     
     
         15 . A method of forming a circuit article for use with an inkjet printer pen body, the method comprising: 
 coating a cross-linkable precursor onto a carrier film, the cross-linkable precursor comprising an epoxidized styrene-diene block copolymer and a thermal-curing agent;    laminating a flexible circuit adjacent the cross-linkable precursor, wherein the flexible circuit has a plurality of conductive traces that are encapsulated by the cross-linkable precursor; and    thermal curing the cross-linkable precursor.    
     
     
         16 . The method of  claim 15 , wherein the thermal curing is performed at a temperature of about 100° C. or less.  
     
     
         17 . The method of  claim 15 , further comprising removing an excess portion of the cross-linkable precursor.  
     
     
         18 . The method of  claim 17 , wherein removing the excess portion of the cross-linkable precursor comprises spraying the cross-linkable precursor with at least one solvent.  
     
     
         19 . The method of  claim 15 , wherein the epoxidized aromatic-diene block copolymer comprises an epoxidized styrene-butadiene block copolymer.  
     
     
         20 . The method of  claim 15 , wherein the carrier film comprises a material selected from the group consisting of poly(ethylene naphthalate), poly(ethylene terephthalate, polyimides, and combinations thereof.