US2007163269A1PendingUtilityA1
Heat dissipation module
Est. expiryJan 16, 2026(expired)· nominal 20-yr term from priority
H10W 40/28F28D 15/0233F28F 3/02F25B 2321/023F28D 15/0266F25B 21/02
37
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Claims
Abstract
A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipation module, suitable for performing heat dissipation on a heat source, the heat dissipation module comprising:
a first base, having a first surface and a second surface, wherein the first surface contacts the heat source; a first radiator, contacting the second surface; a thermoelectric cooler, contacting the second surface; and a second radiator, disposed on the thermoelectric cooler.
2 . The heat dissipation module as recited in claim 1 , wherein a cold side of the thermoelectric cooler contacts the second surface, while a hot side of the thermoelectric cooler contacts the second radiator.
3 . The heat dissipation module as recited in claim 1 , wherein the first radiator and the second radiator are spaced apart at a distance.
4 . The heat dissipation module as recited in claim 1 , wherein the first radiator and the first base are integrated together.
5 . The heat dissipation module as recited in claim 1 , wherein the first radiator and the first base are formed into a single body.
6 . The heat dissipation module as recited in claim 1 , further comprising a heat pipe, disposed in the first base and contacting the thermoelectric cooler.
7 . The heat dissipation module as recited in claim 1 , wherein the first radiator comprises a plurality of first fins and a second base, the second radiator comprises a plurality of second fins and a third base, the first fins are connected to the second base, the second fins are connected to the third base, the second base contacts the first base, and the third base contacts the thermoelectric cooler.
8 . The heat dissipation module as recited in claim 7 , wherein the first radiator further comprises a heat pipe and the heat pipe contacts the thermoelectric cooler and the second base.Join the waitlist — get patent alerts
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