Semiconductor device and manufacturing process thereof

Abstract

One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side. Further, the built-in semiconductor package a second molded resin encompassing the die pad, the second semiconductor chip, and the lead frames so that each of the connection regions is exposed and each of the support regions is covered. While the second molded resin has top and bottom surfaces, a plane flush with the connection region locates between the top and bottom surfaces of the second molded resin.

1 . A method of manufacturing a semiconductor device comprising steps of: 
 providing a semiconductor package having a memory IC chip integrating a memory circuitry, a molded resin encompassing the first semiconductor chip and a plurality of connection terminals electrically connecting with the memory IC chip, exposed on a surface of the semiconductor package;    providing a circuit board;    providing a logic IC chip integrating a logic circuitry;    testing electrical performance of the semiconductor package;    after the testing step, mounting the semiconductor package and the logic IC chip over the circuit board and electrically connecting the memory IC chip and the logic IC chip with the circuit board; and    molding a resin encompassing the semiconductor package and the logic IC chip.    
   
   
       2 . The method of manufacturing a semiconductor device according to  claim 1 , wherein after the molding step, the method further comprises a step of testing electrical performance of the semiconductor device.  
   
   
       3 . The method of manufacturing a semiconductor device according to  claim 1 , wherein in the mounting step includes mounting the logic IC chip on the circuit board and mounting the semiconductor package on the logic IC chip.