Heat exchange apparatus

Abstract

In one embodiment, heat exchange device is provided, which includes a printed circuit board with a multichip module mounted on the printed circuit board. A cold plate is positioned on the multichip module and a bolster plate on a side of the printed circuit board opposite the cold plate. A fastener secures the bolster plate and the cold plate with the printed circuit board, and, urges the cold plate against the multichip module and the multichip module against the printed circuit board. The cold plate may form a lid to the multichip module. The multichip module may include a pin electronics die abutting the cold plate. In some embodiments the bolster plate is a compression plate.

1 . A heat exchange device comprising: 
 a) a printed circuit board;    b) a multichip module mounted on the printed circuit board;    c) a cold plate positioned on the multichip module; and    d) a bolster plate located on a side of the printed circuit board opposite the cold plate; and    e) a fastener securing the bolster plate and the cold plate with the printed circuit board, wherein the fastener urges the cold plate against the multichip module and the multichip module against the printed circuit board.    
     
     
         2 . The heat exchange device of  claim 1 , wherein the cold plate forms a lid to the multichip module.  
     
     
         3 . The heat exchange device of  claim 1 , wherein the multichip module further comprises a pin electronics die abutting the cold plate.  
     
     
         4 . The heat exchange device of  claim 3 , wherein pin electronics die abut the cold plate with a thermal paste therebetween.  
     
     
         5 . The heat exchange device of  claim 1  further comprising a conductive elastomer positioned between the multichip module and the printed circuit board.  
     
     
         6 . The heat exchange device of  claim 1 , wherein the multichip module further comprises at least one pin electronics die positioned within the multichip module such that the at least one pin electronics dies is cooled prior to cooling other die within the multichip module.  
     
     
         7 . The heat exchange device of  claim 1 , wherein the bolster plate is a compression plate.  
     
     
         8 . A heat exchange apparatus comprising: 
 a) at least one heat exchanger;    b) an intake manifold in fluid communication with each heat exchanger of the at least one heat exchanger, wherein the intake manifold is capable of providing a heat exchange medium separately to each heat exchanger;    c) a plurality of multichip modules mounted to a card, wherein each multichip module of the plurality of multichip modules is positioned between a heat exchanger and the card, such that heat can transfer between each multichip module and a respective heat exchanger;    d) a bolster plate positioned on a side of the card opposite the multichip modules and the at least one heat exchanger; and    e) a fastener securing the bolster plate and the at least one heat exchanger with the card, wherein the fastener secures the at least one heat exchanger with the multichip module.    
     
     
         9 . The heat exchange apparatus of  claim 8 , wherein each multichip module abuts at least one heat exchanger.  
     
     
         10 . The heat exchange apparatus of  claim 9 , wherein each multichip module is mounted to at least one heat exchanger.  
     
     
         11 . The heat exchange apparatus of  claim 9 , wherein each multichip module is compression mounted to at least one heat exchanger.  
     
     
         12 . The heat exchange apparatus of  claim 9 , wherein each multichip module further comprises a pin electronics die, and wherein the pin electronics die abuts at least one heat exchanger.  
     
     
         13 . The heat exchange apparatus of  claim 8 , wherein each heat exchanger is a cold plate.  
     
     
         14 . The heat exchange apparatus of  claim 13 , wherein the cold plate forms a lid to a multichip module.  
     
     
         15 . The heat exchange apparatus of  claim 8 , wherein the heat exchange medium is an inert liquid.  
     
     
         16 . The heat exchange apparatus of  claim 8  further comprising a connector positioned between the intake manifold and each heat exchanger, such that each heat exchanger can be disconnected from the intake manifold.  
     
     
         17 . The heat exchanger apparatus of  claim 8 , wherein the bolster plate is a compression plate.  
     
     
         18 . A heat exchange apparatus comprising: 
 a) at least one heat exchanger;    b) an intake manifold in fluid communication with each heat exchanger of the at least one heat exchanger, wherein the intake manifold is capable of providing a heat exchange medium separately to each heat exchanger;    c) an exhaust manifold adjacent to the intake manifold, the exhaust manifold being in fluid communication with each heat exchanger of the at least one heat exchanger, wherein the exhaust manifold is capable of receiving the heat exchange medium from each heat exchanger;    d) a plurality of multichip modules mounted to a card, wherein each multichip module of the plurality of multichip modules is positioned between a heat exchanger and the card, such that heat can transfer between each multichip module and a respective heat exchanger;    e) the exhaust manifold and the intake manifold positioned above and adjacent to a side of the card; and    f) the plurality of multichip modules being mounted on the side of the card in a position lateral to the intake manifold and the exhaust manifold;    g) a bolster plate positioned on a side of the card opposite the multichip modules and the at least one heat exchanger; and    h) a fastener securing the bolster plate and the at least one heat exchanger with the card, wherein the fastener secures the at least one heat exchanger with the multichip module.    
     
     
         19 . A heat exchange apparatus of  claim 18 , wherein the cold plate forms a lid to the multichip module.  
     
     
         20 . The heat exchange apparatus of  claim 18 , wherein the multichip module further comprises a pin electronics die abutting the cold plate.  
     
     
         21 . The heat exchange apparatus of  claim 18 , wherein pin electronics die abut the cold plate with a thermal paste therebetween.  
     
     
         22 . The heat exchange apparatus of  claim 18  further comprising a conductive elastomer positioned between the multichip module and the printed circuit board.  
     
     
         23 . The heat exchange apparatus of  claim 18 , wherein the bolster plate is a compression plate.  
     
     
         24 . The heat exchange apparatus of  claim 18  further comprising a connector positioned between the intake manifold and each heat exchanger, further comprising a connector positioned between the exhaust manifold and each heat exchanger, such that each heat exchanger can be disconnected from the intake manifold and the exhaust manifold.