US2007154649A1PendingUtilityA1

Method for producing a space layer in between two disks with high uniformity

51
Assignee: OC OERLIKON BALZERS AGPriority: Dec 22, 2005Filed: Dec 21, 2006Published: Jul 5, 2007
Est. expiryDec 22, 2025(expired)· nominal 20-yr term from priority
Inventors:Bernd HeinzCem YavaserThomas Pfaff
B32B 2310/0831B32B 2038/0076G11B 7/26B29C 66/452B29C 65/14B32B 2429/02G11B 7/24018B29C 2035/0827B29C 65/1487B29C 66/1122B32B 37/12B29C 65/521B29K 2105/243C09J 5/02C09J 2400/228B29L 2017/005B29C 66/72321B29C 65/76B29C 66/82661B29C 65/4845B29C 65/1406B32B 2309/68B32B 37/025B29C 66/73161B29C 66/001
51
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for bonding of disk shaped substrates comprises the steps of providing a first and a second substrate, applying a liquid adhesive to a first bonding surface and a second surface, irradiating the lacquered surface of at least one of the substrates with UV light for increasing the viscosity of the lacquer, joining the substrates in vacuum, irradiating the joined disk with UV light for increasing the viscosity of the lacquer in between the joined disks, placing the disk onto a rotatable chuck, rotating the disc with a rotation speed preferably >500rpm, and finally separating the 2 substrates to leave the full bonding layer on one of the substrates.

Claims

exact text as granted — not AI-modified
1 . A method for bonding of disk shaped substrates, comprising the steps of: 
 providing a first and a second substrate to be bonded via respective surfaces,    applying a liquid adhesive to a first surface and a second surface on said first and second substrates,    irradiating the adhesive-lacquered surface of at least one of the substrates with UV light for increasing the viscosity of the lacquer,    joining the substrates in vacuum thereby forming a bonding layer,    irradiating the joined substrates with UV light for increasing the viscosity of the lacquer in between the joined substrates,    placing the joined substrates onto a rotatable chuck,    rotate the joined substrates with a rotation speed >500 rpm,    separate the joined substrates to leave the full bonding layer on one of the substrates,    
     
     
         2 . A method according to  claim 1 , further comprising a step of irradiating the substrates for final hardening of the bonding layer before or after the separation step.  
     
     
         3 . A method according to  claim 1 , characterized in that a UV intensity is used for the first irradiation step is in a range of 10 to 100 mW/cm2.  
     
     
         4 . A method according to  claim 1 , characterized in that one UV source is used for both irradiating steps.  
     
     
         5 . A method according to  claim 1 , characterized in that the irradiation step after bonding is done within one second after bonding, preferably 0.5 s after bonding.  
     
     
         6 . A method according to to  claim 1 , characterized in that the bonding and separation process includes the transfer of a earlier sputtered layer from the stamper disk onto the first substrate.  
     
     
         7 . A method according to  claim 1 , characterized in that two different lacquers are applied on the individual substrates.  
     
     
         8 . A method according to  claim 1 , wherein the irradiating UV light is being supplied by means of a light-guide.

Join the waitlist — get patent alerts

Track US2007154649A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.