Mounting seat for an integrated circuit and a circuit board and method of manufacturing the same

Abstract

A mounting seat for an integrated circuit (IC) and a circuit board includes a base formed by way of powder metallurgy, two pin holes formed on the base, and two positioning pins, which may be respectively formed in the pin holes by way of insert molding or inserted into the pin holes by way of assembling. Thus, a surface of the base may be quickly molded to form the positioning pins or assembled with the positioning pins, which are made of a material different from that of the base. Consequently, the method of manufacturing the mounting seat is simple and timesaving, and the manufacturing cost can be reduced.

1 . A method of manufacturing a mounting seat for an integrated circuit (IC) and a circuit board, the method comprising the steps of:
 forming a base by way of powder metallurgy and forming two pin holes on the base; and   placing the base in a mold and forming two positioning pins protruding beyond a surface of the base in the pin holes by way of injection molding.   
   
   
       2 . The method according to  claim 1 , wherein the positioning pins are formed by way of insert molding. 
   
   
       3 . The method according to  claim 1 , wherein the positioning pins are made of a plastic material or a Bakelite material. 
   
   
       4 . A method of manufacturing a mounting seat for an integrated circuit (IC) and a circuit board, the method comprising the steps of:
 forming a base by way of powder metallurgy and forming two pin holes on the base;   forming two positioning pins separated from the base by way of injection molding; and   assembling the positioning pins with the base by inserting the positioning pins into the pin holes respectively, wherein one end of each of the positioning pins protrudes beyond a surface of the base.   
   
   
       5 . The method according to  claim 4 , wherein the positioning pins are made of a plastic material or a Bakelite material. 
   
   
       6 . A mounting seat for an integrated circuit (IC) and a circuit board, the mounting seat comprising:
 a base;   two pin holes formed on the base and at two opposite ends of the base; and   two positioning pins each having a first end and a second end, wherein the first ends of the positioning pins are fixed into the two pin holes, respectively, and the second ends of the positioning pins protrude beyond a surface of the base.   
   
   
       7 . The mounting seat according to  claim 6 , wherein the pin holes penetrate through the mounting seat. 
   
   
       8 . The mounting seat according to  claim 6 , wherein the second end of the positioning pin is formed with a guiding slant at a circumference of the positioning pin. 
   
   
       9 . The mounting seat according to  claim 6 , wherein the positioning pin is adhered to the pin hole. 
   
   
       10 . The mounting seat according to  claim 6 , wherein the positioning pin is fixed into the pin hole by way of insert molding. 
   
   
       11 . The mounting seat according to  claim 6 , wherein the surface of the base is formed with an accommodating opening for accommodating the IC. 
   
   
       12 . The mounting seat according to  claim 6 , wherein a protruding heat sink is disposed on the surface of the base. 
   
   
       13 . The mounting seat according to  claim 6 , wherein the surface of the base is formed with an accommodating opening and a heat sink is disposed on the surface of the base, and the heat sink crosses over two sides of the accommodating opening and protrudes beyond the surface of the base.