Monitoring Device of Chemical Mechanical Polishing Apparatus

Abstract

A monitoring device and method of a chemical mechanical polishing apparatus are provided. Embodiments may form a uniform surface of a polishing pad and monitor a CMP process by incorporating piezoelectric sensors capable of monitoring a pressure applied to a pad on a rear surface of a polishing pad. The monitoring device can include: a polishing pad; a plurality of piezoelectric sensors formed at a rear surface of the polishing pad for detecting a pressure applied to the polishing pad; a communication section connected to the piezoelectric sensors for transmitting data detected by the piezoelectric sensors; and a display section for displaying the data transmitted from the communication section.

1 . A monitoring device of a chemical mechanical polishing apparatus, comprising: 
 a polishing pad;    a plurality of piezoelectric sensors formed at a rear surface of the polishing pad for detecting a pressure applied to the polishing pad;    a communication section connected to the piezoelectric sensors for transmitting data detected by the piezoelectric sensors; and    a display section for displaying the data transmitted from the communication section.    
     
     
         2 . The monitoring device according to  claim 1 , wherein each of the plurality of piezoelectric sensors is a polymer sensor.  
     
     
         3 . The monitoring device according to  claim 1 , wherein the plurality of piezoelectric sensors are capable of detecting pressure applied to the polishing pad according to a position of the polishing pad.  
     
     
         4 . The monitoring device according to  claim 1 , wherein the communication section comprises a blue tooth, zigbee, infrared ray communication, or ultra wide band transmission.  
     
     
         5 . The monitoring device according to  claim 1 , wherein the communication section comprises: 
 a signal pass filter for receiving and filtering data detected by the plurality of piezoelectric sensors;    an analog/digital converter for converting an analog signal outputted from the signal pass filter into a digital signal; and    a blue tooth communication section for transmitting the digital signal from the analog/digital converter to the display section.    
     
     
         6 . The monitoring device according to  claim 1 , wherein the polishing pad is a polymer film.  
     
     
         7 . The monitoring device according to  claim 1 , wherein the polishing pad comprises regularly formed grooves.  
     
     
         8 . A method for monitoring a chemical mechanical polishing apparatus, comprising: 
 providing a plurality of piezoelectric sensors at a rear surface of a polishing pad;    detecting a pressure applied to the polishing pad by the plurality of piezoelectric sensors; and    transmitting data corresponding to pressure detected by the plurality of piezoelectric sensors to a display section for displaying the data.    
     
     
         9 . The method according to  claim 8 , wherein transmitting the data comprises using a wireless communication.  
     
     
         10 . The method according to  claim 9 , wherein the wireless communication uses a bluetooth module.  
     
     
         11 . The method according to  claim 8 , wherein the polishing pad is formed by a process comprising: 
 preparing a master mold in which negative-phase grooves are formed through an etching process;    mounting a polymer film to face the master mold;    applying heat and pressure to the master mold and the polymer film to form grooves in the polymer film having a phase inverse to the negative phase grooves of the master mold; and    cooling the polymer film.