Thermal conductive apparatus

Abstract

A thermal conductive apparatus includes a first electrode sheet, a second electrode sheet, a cooling sheet, and a polymer dielectric layer. The polymer dielectric layer physically contacts the first electrode sheet and the second electrode sheet via the top surface thereof, and the cooling sheet via the bottom surface thereof, and exhibits a coefficient of thermal conductivity above 1.0 W/mK. The interfaces between the first electrode sheet, the second electrode sheet, the cooling sheet, and the polymer dielectric layer include at least one micro-rough surface. The micro-rough surfaces include plural nodules thereon formed by electrodeposition. The first electrode sheet and the second electrode sheet are electrically insulated from each other and are connected to a power source and a heat-generating device to form a conductive circuit loop.

1 . A thermal conductive apparatus, comprising: 
 a cooling sheet;    a first electrode sheet;    a second electrode sheet electrically insulated from the first electrode sheet; and    a polymer dielectric layer having a coefficient of thermal conductivity larger than 1.0 W/mK and being laminated between the first electrode sheet, the second electrode sheet and the cooling sheet in a physical contact manner, and the interfaces between the first electrode sheet and the polymer dielectric layer, the second electrode sheet and the polymer dielectric layer, and the cooling sheet and the polymer dielectric layer comprising at least one micro-rough surface.    
   
   
       2 . The thermal conductive apparatus of  claim 1 , wherein the at least one micro-rough surface comprises a plurality of nodules.  
   
   
       3 . The thermal conductive apparatus of  claim 2 , wherein the nodules consist essentially of size ranging from 0.1 μm to 100 μm, protrude perpendicularly to a surface of the cooling sheet and to surfaces of the first electrode sheet and the second electrode sheet and expand parallel to the surfaces of the cooling sheet, the first electrode sheet and the second electrode sheet with a distance from 0.1 μm to 100 μm.  
   
   
       4 . The thermal conductive apparatus of  claim 1 , wherein the first electrode sheet and the second electrode sheet are formed by separating a metal sheet through an etching process.  
   
   
       5 . The thermal conductive apparatus of  claim 1 , further comprising a first plating layer and a second plating layer respectively disposed on surfaces of the first electrode sheet and the second electrode sheet for increasing the welding strength between the first electrode sheet, the second electrode sheet, and a heat-generating device.  
   
   
       6 . The thermal conductive apparatus of  claim 1 , wherein the first electrode sheet and the second electrode sheet are connected to a power source and a heat-generating device to form a conductive circuit loop.  
   
   
       7 . The thermal conductive apparatus of  claim 6 , wherein the heat-generating device is a light emitting diode (LED).  
   
   
       8 . The thermal conductive apparatus of  claim 1 , wherein the polymer dielectric layer comprises at least one heat-conductive dielectric filler.  
   
   
       9 . The thermal conductive apparatus of  claim 8 , wherein the heat-conductive dielectric filler is selected from the group consisting of aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN) and boron nitride (BN).  
   
   
       10 . The thermal conductive apparatus of  claim 8 , wherein the coefficient of thermal conductivity of the heat-conductive dielectric filler is above 10.0 W/mK.  
   
   
       11 . The thermal conductive apparatus of  claim 8 , wherein the amount of the heat-conductive dielectric filler is in the range of 40%-70% by volume of the polymer dielectric layer.  
   
   
       12 . The thermal conductive apparatus of  claim 1 , wherein the material of the cooling sheet is copper or aluminum.  
   
   
       13 . The thermal conductive apparatus of  claim 1 , wherein the polymer dielectric layer comprises a plurality of polymer dielectric sub-layers.  
   
   
       14 . The thermal conductive apparatus of  claim 1 , wherein the at least one micro-rough surface comprises an anti-oxidation layer.  
   
   
       15 . The thermal conductive apparatus of  claim 1 , wherein the thickness of the cooling sheet is above 0.03 mm.