Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Abstract

A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

1 . A method for fabricating a semiconductor component comprising: 
 providing a substrate;    forming an adjustment circuit on the substrate comprising a plurality of conductors, and a plurality of programmable links in electrical communication with the conductors;    attaching a die to the substrate in electrical communication with the conductors; and    changing a physical characteristic or an electrical characteristic of at least one conductor by placing the programmable links in a selected state.    
     
     
         2 . The method of  claim 1  wherein the physical characteristic comprise length and the changing step trims the length.  
     
     
         3 . The method of  claim 1  wherein the electrical characteristic comprises capacitance and the changing step adds capacitance.  
     
     
         4 . The method of  claim 1  wherein the electrical characteristic comprises inductance and the changing step adds inductance.  
     
     
         5 . The method of  claim 1  further comprising forming terminal contacts on the substrate in electrical communication with the conductors and changing an input/output configuration of the terminal contacts using the programmable links.  
     
     
         6 . A method for fabricating a semiconductor component comprising: 
 providing a substrate;    forming an adjustment circuit on the substrate comprising a plurality of conductors, a plurality of programmable links in electrical communication with the conductors, and a plurality of capacitors in electrical communication with the programmable links;    attaching a die to the substrate in electrical communication with the conductors; and    adding capacitance to selected conductors by placing the programmable links in a selected state.    
     
     
         7 . The method of  claim 6  further comprising forming the adjustment circuit with a plurality of second programmable links configured to trim portions of the conductors, and trimming the portions using the second programmable links.  
     
     
         8 . The method of  claim 6  wherein the capacitors comprise metal and dielectric layers deposited on the substrate.  
     
     
         9 . The method of  claim 6  wherein the capacitors comprise surface mounted devices.  
     
     
         10 . The method of  claim 6  further comprising changing a physical characteristic of at least one conductor using at least one programmable link.  
     
     
         11 . The method of  claim 6  further comprising forming terminal contacts on the substrate in electrical communication with the conductors and changing an input/output configuration of the terminal contacts using the programmable links.  
     
     
         12 . A method for fabricating a semiconductor component comprising: 
 providing a substrate;    forming an adjustment circuit on the substrate comprising a plurality of conductors, a plurality of programmable links in electrical communication with the conductors, and a plurality of inductance conductors in electrical communication with the programmable links;    attaching a die to the substrate in electrical communication with the conductors; and    adding inductance to selected conductors by placing the programmable links in a selected state.    
     
     
         13 . The method of  claim 12  further comprising forming the adjustment circuit with a plurality of second programmable links configured to trim portions of the conductors, and trimming the portions using the second programmable links.  
     
     
         14 . The method of  claim 12  wherein each conductor is associated with a plurality of inductance conductors.  
     
     
         15 . The method of  claim 12  further comprising changing a physical characteristic of at least one conductor using at least one programmable link.  
     
     
         16 . The method of  claim 12  further comprising forming terminal contacts on the substrate in electrical communication with the conductors and changing an input/output configuration of the terminal contacts using the programmable links.  
     
     
         17 . A method for fabricating a semiconductor component comprising: 
 providing a substrate comprising a plurality of terminal contacts;    attaching a semiconductor die to the substrate in electrical communication with the terminal contacts;    providing an adjustment circuit on the substrate comprising a plurality of conductors and programmable links in electrical communication with the die and the terminal contacts; and    adjusting an electrical characteristic of at least one conductor and an input/output configuration of the terminal contacts by placing at least one of the programmable links in a selected state.    
     
     
         18 . The method of  claim 17  wherein the electrical characteristic comprises capacitance and the adjusting step adds capacitance.  
     
     
         19 . The method of  claim 17  wherein the electrical characteristic comprises inductance and the adjusting step adds inductance.  
     
     
         20 . The method of  claim 17  further comprising changing a physical characteristic of at least one conductor using at least one programmable link.