US2007135655A1PendingUtilityA1
Use of fluorinated additives in the etching or polishing of integrated circuits
Est. expiryFeb 1, 2022(expired)· nominal 20-yr term from priority
H10P 50/667H10P 52/403C11D 1/004C09G 1/02C09K 13/08C11D 2111/22
49
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Claims
Abstract
Use in etching or polishing of integrated circuits of fluorinated additives of formula (I): T′(C 3 F 6 O) n (CFXO) m T (I) having a number average molecular weight in the range 250-400, in particular of the compound Cl(CF 2 —CF(CF 3 )O) n CF 2 COONa.
Claims
exact text as granted — not AI-modified1 . Compounds of formula (II)
Cl(CF 2 —CF(CF 3 )O) n CF 2 COOM (II)
wherein M=H, ammonium or a metal ion; n=1.
2 . Compounds according to claim 1 , wherein M=Li, Na or K.Join the waitlist — get patent alerts
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