Probe card and method for manufacturing probe card

Abstract

A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.

1 . A method for manufacturing a contact probe of a probe card used when conducting an electric test on a chip having a plurality of pads, the method comprising the steps of: 
 preparing an insulation base material having a plurality of parallel wires; and    cutting the insulation base material so that the contact probe has contact wires, the number of which is equal to the number of the pads.    
   
   
       2 . The method according to  claim 1 , wherein the number of the parallel wires is greater than the number of the pads arranged on one side of the chip.  
   
   
       3 . The method according to  claim 1 , wherein the step for preparing the insulation layer includes forming the parallel wires with a predetermined pitch by conducting photolithography.  
   
   
       4 . The method according to  claim 1 , wherein the base material includes a signal layer having a plurality of wires and an insulation layer formed on the signal layer, the method further comprising the step of: 
 electrically connecting a distal end of a predetermined one of the contact wires to the ground layer.    
   
   
       5 . The method according to  claim 4 , wherein the connecting step includes connecting the distal end of the predetermined one of the contact wires to the ground layer with a bonding wire.  
   
   
       6 . The method according to  claim 4 , wherein the connecting step includes forming a through hole extending through the insulation layer and the ground layer at a position adjacent to the distal end of the predetermined contact wire, and charging conductive material in the through hole to connect the ground layer and the signal layer.