Semiconductor device and support method for designing the same

Abstract

A semiconductor device includes a bundle of wiring lines arranged in parallel and connected to a macro cell to transfer a same signal; and a bridge wiring line configured to bridge adjacent ones of the wiring lines of the bundle. Wiring line resistances between ends of the adjacent wiring lines in the macro cell and nodes of the bridge wiring line with the adjacent two wiring lines are different from each other.

1 . A semiconductor device comprising: 
 a bundle of wiring lines arranged in parallel and connected to a macro cell to transfer a same signal; and    a bridge wiring line configured to bridge adjacent ones of said wiring lines of the bundle,    wherein wiring line resistances between ends of said adjacent wiring lines in said macro cell and nodes of said bridge wiring line with said adjacent two wiring lines are different from each other.    
   
   
       2 . The semiconductor device according to  claim 1 , wherein said bundle of wiring lines comprises: 
 a first wiring line connected at a first end with said macro cell; and    a second wiring line connected at a second end with said macro cell,    said bridge wiring line connects first and second nodes on said first and second wiring lines, and    a wiring line resistance between said first end and said first node is different from a wiring line resistance between said second end and said second node.    
   
   
       3 . The semiconductor device according to claim  2 , wherein a distance between said first end and said first node is different from a distance between said second end and said second node.  
   
   
       4 . The semiconductor device according to  claim 2 , wherein a line width of said first wiring line between said first ends and said first node is different from a line width of said second wiring line between said second ends and said second node.  
   
   
       5 . The semiconductor device according to  claim 1 , wherein said bundle of wiring lines comprises: 
 a first wiring line;    a second wiring line arranged adjacently to said first wiring line; and    a third wiring line arranged adjacently to said second wiring line,    a first bridge wiring line extends along a first line to bridge said first wiring line and said second wiring line, and    a second bridge wiring line extends along a second line different from said first line to bridge said second wiring line and said third wiring line.    
   
   
       6 . The semiconductor device according to  claim 1 , wherein said bundle of wiring lines comprises: 
 a first wiring layer wiring line formed in a first wiring layer; and    a second wiring layer wiring line formed in a second wiring layer,    said first wiring layer wiring line and said second wiring layer wiring line are connected to each other by a via-contact in an overlapping area, and    said bridge wiring line is provided in said overlapping area.    
   
   
       7 . A support method for designing a semiconductor device, comprising: 
 arranging a bundle of wiring lines in parallel in a wiring layer to transfer a same signal; and    arranging a bridge wiring line in said wiring layer to bridge adjacent wiring lines,    said bundle of wiring lines and said bridge wiring line are arranged such that wiring line resistances between ends of adjacent wiring lines of the bundle and nodes of said bridge wiring line with said adjacent wiring lines are different from each other.    
   
   
       8 . The support method according to  claim 7 , wherein said arranging a bundle of wiring lines comprises: 
 arranging a first wiring line connected at a first end with a macro cell; and    arranging a second wiring line connected at a second end with said macro cell,    said arranging a bridge wiring line comprises:    arranging said bridge wiring line to connect a first node on said first wiring line and a second node on said second wiring line, and    a wiring line resistance between said first end and said first node is different from a wiring line resistance between said second end and said second node.    
   
   
       9 . The support method according to  claim 7 , wherein said arranging a bundle of wiring lines comprises: 
 arranging a first wiring line connected at a first end with a macro cell; and    arranging a second wiring line connected at a second end with said macro cell,    said arranging a bridge wiring line comprises:    arranging said bridge wiring line to connect a first node on said first wiring line and a second node on said second wiring line, and    a distance between said first end and said first node is different from a distance between said second end and said second node.    
   
   
       10 . The support method according to  claim 7 , wherein said arranging a bundle of wiring lines comprises: 
 arranging a first wiring line connected at a first end with a macro cell; and    arranging a second wiring line connected at a second end with said macro cell, said arranging a bridge wiring line comprises:    arranging said bridge wiring line to connect a first node on said first wiring line and a second node on said second wiring line, and    a line width of said first wiring line between said first ends and said first node is different from a line width of said second wiring line between said second ends and said second node.    
   
   
       11 . The support method according to  claim 7 , wherein said arranging a bundle of wiring lines comprises: 
 a first wiring line;    a second wiring line arranged adjacently to said second wiring line; and    a third wiring line arranged adjacently to said second wiring line,    a first bridge wiring line extends along a first line to bridge said first wiring line and said second wiring line, and    a second bridge wiring line extends along a second line different from said first line to bridge said second wiring line and said third wiring line.    
   
   
       12 . The support method according to  claim 7 , wherein said bundle of wiring lines comprises: 
 a first wiring layer wiring line formed in a first wiring layer; and    a second wiring layer wiring line formed in a second wiring layer,    said first wiring layer wiring line and said second wiring layer wiring line are connected to each other by a via-contact in an overlapping area, and    said bridge wiring line is provided in said overlapping area.