Roll-off reducing agent
Abstract
A roll-off reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; and a roll-off reducing agent composition comprising a roll off-reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; an abrasive; and water.
Claims
exact text as granted — not AI-modified1 . A polishing composition comprising:
water; an abrasive; a roll-off reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; and an intermediate alumina.
2 . A polishing composition comprising:
(A) one or more compounds selected from carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; (B) one or more compounds selected from polycarboxylic acids having 4 or more carbon atoms and having neither OH group or groups nor SH group or groups, aminopolycarboxylic acids, amino acids and salts thereof; and (C) one or more compounds selected from an intermediate alumina and an alumina sol; an abrasive; and water.
3 . The polishing composition according claim 2 , wherein the intermediate alumina and the alumina sol in Compounds (C) have a specific surface area of from 30 to 300 m 2 /g and an average particle size of 0.01 to 5 μm.
4 . The polishing composition according to claim 2 , wherein the intermediate alumina is prepared from aluminum hydroxide and/or an alumina sol, each having a specific surface area of 10 m 2 /g or more and a content of an alkali metal and a content of an alkaline earth metal of 0.1% by weight or less.
5 . A polishing composition comprising:
(A) one or more compounds selected from carboxylic acids having 2 to 20 carbon atoms having either OH group or groups of SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and thereof; and (B) one or more compounds selected from polycarboxylic acids having 4 or more carbon atoms and having neither OH group or groups nor SH group or groups, aminopolycarboxylic acids, amino acids and salts thereof; an abrasive; and water.
6 . The polishing composition according to claim 5 , wherein one or more compounds of Compounds (A) are selected from carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof, and wherein one or more compounds of Compounds (B) are selected from polycarboxylic acids having 4 or more carbon atoms and having neither OH group or groups nor SH group or groups, aminopolycarboxylic acids, and salts thereof.
7 . The polishing composition according to claim 5 , wherein one or more compounds of Compounds (A) are selected from oxalic acid, malonic acid, glycolic acid, lactic acid, malic acid, glyoxylic acid, tartaric acid, citric acid, gluconic acid, and salts thereof, and wherein one ore more compounds of Compounds (B) are selected from succinic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, tricarballylic acid, diglycolic acid, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid, and salts thereof.
8 . A polishing process of a substrate to be polished comprising a step of polishing the substrate to be polished with the polishing composition of any one of claims 1 to 7 .Join the waitlist — get patent alerts
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