US2007128557A1PendingUtilityA1
Phototool coating
Est. expiryAug 21, 2023(expired)· nominal 20-yr term from priority
G03F 7/2014G03F 1/78G03F 7/20B82Y 30/00G03F 7/00G03F 1/48
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Claims
Abstract
A phototool having a fluorinated phosph(on)ate coating and methods of using the phototool.
Claims
exact text as granted — not AI-modified1 . A method of patterning a device using a phototool comprising:
(a) applying a layer comprising a fluorinated phosph(on)ate material to a first surface of the phototool; (b) placing the coated first surface of the phototool against the device such that the layer of fluorinated phosph(on)ate is in contact with the device; and (c) applying radiation to a second surface of the phototool for affecting a pattern in the device.
2 . The method of claim 1 wherein the fluorinated phosph(on)ate is selected from the group consisting of
where the value of n ranges from 3 to about 10.
3 . The method of claim 1 wherein the fluorinated phosph(on)ate is poly(hexafluoropropyleneoxide-co-difluoromethylene oxide) alcohol ethoxylated phosphate.
4 . The method of claim 1 wherein the thickness of the layer of the fluorinated phosph(on)ate material is less than or equal to about 6 nm.
5 . The method of claim 1 wherein the fluorinated phosph(on)ate is applied using a dilute solution in hydrofluoroether solvent.
6 . The method of claim 5 wherein the dilute solution further comprises a perfluoropolyether silane.
7 . The method of claim 1 wherein the fluorinated phosph(on)ate comprises a phosphate group.
8 . The method of claim 1 wherein the fluorinated phosph(on)ate comprises a phosphonate ester, salt, or acid group.
9 . The method of claim 1 wherein the fluorinated phosph(on)ate comprises a monophosphate ester.
10 . The method of claim 1 wherein the fluorinated phosph(on)ate comprises a phosphonic acid.
11 . A method of creating patterns in a patternable material comprising
(a) applying a layer of a fluorinated phosph(on) ate material to a first surface of a phototool; (b) applying photoresist to a surface of the patternable material; (c) placing the first surface of the phototool in contact with the photoresist; (d) applying radiation to the phototool to form a pattern in the photoresist; (e) removing a portion of the photoresist to expose a portion of the patternable material surface; and (f) modifying the exposed surface of the patternable material where the photoresist was removed.
12 . The method of claim 11 wherein (f) comprises removing material from the exposed surface.
13 . The method of claim 11 wherein (f) comprises adding material to the exposed surface.
14 . The method of claim 11 wherein the patternable layer is a dielectric layer.
15 . The method of claim 11 wherein the patternable layer is a metal layer.Join the waitlist — get patent alerts
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