Solder alloy, solder ball, and solder joint using the same

Abstract

A solder alloy is provided, which consists of, by mass %: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn and incidental impurities. Preferably an amount of Ag is 0.5 to 1 mass % Preferably, an amount of Ge is more than 0.01 mass % but not more than 0.06 mass %. The solder alloy is preferably spherically formed into a solder ball. A solder joint in which the solder alloy is joined to a Ni electrode is also provided.

1 . A solder alloy consisting of, by mass %: 
 0.6 to 0.75% of Cu;    0.3 to 1.5% of Ag;    more than 0.01% but not more than 0.1% of Ge; and    the balance being Sn and incidental impurities.    
   
   
       2 . The solder alloy according to  claim 1 , wherein the solder alloy contains 0.5 to 1% of Ag by mass %.  
   
   
       3 . The solder alloy according to  claim 1 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.  
   
   
       4 . The solder alloy according to  claim 2 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.  
   
   
       5 . A solder ball formed spherically of a solder alloy, the solder alloy consisting of by mass %: 
 0.6 to 0.75% of Cu;    0.3 to 1.5% of Ag;    more than 0.01% but not more than 0.1% of Ge; and    the balance being Sn and incidental impurities.    
   
   
       6 . The solder ball according to  claim 5 , wherein the solder alloy contains 0.5 to 1% of Ag by mass %.  
   
   
       7 . The solder ball according to  claim 5 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.  
   
   
       8 . The solder ball according to  claim 6 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.  
   
   
       9 . A solder joint, in which a solder alloy is joined to a Ni electrode, the solder alloy consisting of, by mass %; 
 0.6 to 0.75% of Cu;    0.3 to 1.5% of Ag;    mare than 0.01% but not more than 0.1% of Ge; and    the balance being Sn and incidental impurities.    
   
   
       10 . The solder joint according to  claim 9 , wherein the solder alloy contains 0.5 to 1% of Ag by mass %.  
   
   
       11 . The solder joint according to  claim 9 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.  
   
   
       12 . The solder joint according to  claim 10 , wherein the solder alloy contains more than 0.01% but not more than 0.06% of Ge by mass %.