Stacked annealing system

Abstract

A process chamber includes an opening, two or more stacked cold plates adjacent the opening, two or more stacked hot plates adjacent the cold plates, and a rotatable wafer transport capable of moving a wafer between the cold plates and between the hot plates for processing of the wafer. The wafer can be rapidly heated while between the hot plates. The wafer transport has perpendicular walls about a pivot such that when the wafer is between the cold plates or between the hot plates, one of the walls separates the cold and hot portions, thereby increasing the efficiency of cooling and heating.

1 . A wafer annealing system, comprising: 
 a process chamber having an opening for inserting and removing a wafer;    a plurality of stacked hot plates;    a plurality of stacked cold plates between the opening and the stacked hot plates; and    a rotatable wafer transport having a pivot between the hot plates and the cold plates and a wafer support for holding the wafer, wherein the wafer transport is configured to rotate the wafer between adjacent cold plates for cooling and between adjacent hot plates for heating.    
   
   
       2 . The system of  claim 1 , wherein the wafer transport further comprises a first wall extending from the pivot and a second wall extending from the pivot, wherein the first and second walls form a 90° angle from the pivot.  
   
   
       3 . The system of  claim 2 , wherein the wafer support is coupled to the first wall.