US2007127004A1PendingUtilityA1
Exposure apparatus and device manufacturing method
Est. expiryDec 26, 2023(expired)· nominal 20-yr term from priority
Inventors:Masami Yonekawa
H10P 72/0474H10P 72/0466H10P 72/0441H10P 72/0602G03F 7/70841G03F 7/70858G03F 7/70808G03F 7/70916G03F 7/7085G03F 7/70525
50
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Claims
Abstract
An exposure apparatus for exposing a substrate. The apparatus includes an optical system being set at a reference temperature, for directing light to the substrate, an exposure chamber for storing the optical system in a vacuum ambience, and a load-lock chamber, disposed adjacent to the exposure chamber, for converting an ambience of a space surrounding the substrate into a vacuum ambience. When the load-lock chamber converts the ambience of the space surrounding the substrate into a vacuum ambience, the temperature of the load-lock chamber is made higher than the reference temperature.
Claims
exact text as granted — not AI-modified1 - 13 . (canceled)
14 . An exposure apparatus for exposing a substrate, said apparatus comprising:
an optical system being set at a reference temperature, for directing light to the substrate; an exposure chamber for storing the optical system in a vacuum ambience; a load-lock chamber disposed adjacent said exposure chamber, for converting an ambience of a space surrounding the substrate into a vacuum ambience; and at least one of a heat insulating material and a heat insulating structure provided between said load-lock chamber and said exposure chamber.
15 . An apparatus according to claim 14 , wherein the time in which the substrate is introduced into said load-lock chamber and the time in which heating means applies heat to said load-lock chamber are at least partially overlapped with each other.
16 . (canceled)
17 . A device manufacturing method, comprising the steps of:
exposing a substrate by use of an exposure apparatus as recited in claim 14; and developing the exposed substrate.Join the waitlist — get patent alerts
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