US2007122919A1PendingUtilityA1

Method of producing an integrated circuit arrangement with field-shaping electrical conductors

Assignee: INFINEON TECHNOLOGIES AGPriority: Sep 6, 2000Filed: Jan 24, 2007Published: May 31, 2007
Est. expirySep 6, 2020(expired)· nominal 20-yr term from priority
Inventors:Joachim Bangert
G11C 11/1675G11C 11/1659G11C 11/15H10N 50/10
39
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Claims

Abstract

An integrated circuit arrangement includes at least one electrical conductor that, when a current flows through it, produces a magnetic field that acts on at least a further part of the circuit arrangement, wherein seen in cross section, the electrical conductor has at least one recess or depression, or a region of reduced conductivity on the side facing that part, in order to influence the magnetic field which can be produced.

Claims

exact text as granted — not AI-modified
1 . A method for producing an integrated circuit arrangement having one or more electrical conductors lying in a plane, which comprises: 
 producing a further part in the form of a layer that can be influenced by a magnetic field, and subsequently carrying out the following steps:    producing a material layer of nonconductive material corresponding to a position of an electrical conductor to be produced subsequently;    reducing at least one of a thickness and a width of the material layer;    applying an electrical conductor covering the material layer.    
   
   
       2 . The method according to  claim 1 , wherein a varnish, which is exposed and developed before reduction, is used as the material.  
   
   
       3 . The method according to  claim 2 , wherein the varnish is incinerated for reduction.

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