Semiconductor light emitting device

Abstract

A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shaped portion to outside the mold resin. A first lead is provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a first direction, and a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction. A light emitting element is mounted on the first lead in the cup shape portion, and a wire electrically connects the light emitting element and the second lead. A sealing resin is embedded in the one or more holes and the one or more trenches and is configured to seal the light emitting element and the wire.

1 . A semiconductor light emitting device, comprising: 
 a mold resin having a cup shape portion on an upper surface of the mold resin and a hole penetrating through the cup shape portion to outside the mold resin;    a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a first direction;    a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction;    a light emitting element mounted on the first lead in the cup shape portion;    a wire electrically connecting the light emitting element and the second lead; and    a sealing resin embedded in the hole and configured to seal the light emitting element and the wire.    
   
   
       2 . The semiconductor light emitting device of  claim 1 , wherein the mold resin has a first trench extending from the cup shape portion to outside of the mold resin in a third direction and a second trench extending from the cup shape portion to outside of the mold resin in a fourth direction which is opposite to the third direction, 
 wherein the sealing resin is embedded in the first trench and the second trench.    
   
   
       3 . A semiconductor light emitting device of  claim 2 , wherein the first direction is perpendicular to the third direction.  
   
   
       4 . A semiconductor light emitting device of  claim 2 , wherein the first direction is parallel to the third direction.  
   
   
       5 . A semiconductor light emitting device of  claim 2 , wherein the mold resin has a third trench extending from the cup shape portion to outside of the mold resin in a fifth direction which is perpendicular to the third direction and a fourth trench extending from the cup shape portion to outside of the mold resin in a sixth direction which is opposite to the fifth direction and perpendicular to the third direction, 
 wherein the sealing resin is embedded in the third trench and the fourth trench are embedded by the sealing resin.    
   
   
       6 . A semiconductor light emitting device of  claim 5 , wherein the first direction is perpendicular to the third direction.  
   
   
       7 . A semiconductor light emitting device of  claim 5 , wherein the first direction is parallel to the third direction.  
   
   
       8 . A semiconductor light emitting device of  claim 2 , wherein the first trench is in contact with the first lead and the second trench is in contact with the second lead.  
   
   
       9 . A semiconductor light emitting device, comprising: 
 a mold resin having a cup shape portion on an upper surface of the mold resin and a hole penetrating through the cup shape portion to outside of the mold resin;    a first lead having a first inner lead portion and a first outer lead portion, the first outer lead portion extending from the cup shape portion to outside of the mold resin in a first direction, the first inner lead portion provided in the cup shape portion and being thicker than the first outer lead portion;    a second lead having a second inner lead portion and a second outer lead portion, the second outer lead portion extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction, the second inner lead portion provided in the cup shape portion;    a semiconductor light emitting element mounted on the first inner lead portion of the first lead;    a wire connecting the semiconductor light emitting element and the second inner lead portion of the second lead;    a sealing resin embedded in the hole and configured to seal the light emitting element and the wire.    
   
   
       10 . A semiconductor light emitting device of  claim 9 , wherein the first inner lead portion of the first lead has a cavity and the light emitting element is mounted on the cavity.