Electrical circuit apparatus

Abstract

An electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

1 . An electrical circuit apparatus comprising; 
 a substrate comprising a top side, a ground layer, at least one thermal aperture, and at least one solder aperture;    a heat sink; and    an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer comprising at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.    
   
   
       2 . The apparatus of  claim 1  further comprising a device coupled to the top side of the substrate such that at least a portion of the device covers at least a portion of the at least one substrate thermal aperture, and wherein the device is coupled to the heat sink via at least a portion of the at least one substrate thermal aperture.  
   
   
       3 . The apparatus of  claim 2 , wherein the device comprises at least one input terminal and a ground terminal, and the predetermined area is located other than beneath the ground terminal.  
   
   
       4 . The apparatus of  claim 3 , wherein the predetermined area is located other then beneath any portion of the device.  
   
   
       5 . The apparatus of  claim 2 , wherein the heat sink has a coefficient of thermal expansion that is higher than that of said device.  
   
   
       6 . The apparatus of  claim 2 , wherein the device is a ceramic device.  
   
   
       7 . The apparatus of  claim 1 , wherein the adhesive layer comprises an electrically non-conducting material.  
   
   
       8 . The apparatus of  claim 7 , wherein the electrically non-conductive material is acrylic.  
   
   
       9 . The apparatus of  claim 1 , wherein the adhesive layer has a predetermined thickness.  
   
   
       10 . The apparatus of  claim 1 , wherein the adhesive layer further comprises at least one venting aperture located on a predetermined area of the adhesive layer to enable the escape of solder volatiles during solder reflow.  
   
   
       11 . The apparatus of  claim 10 , wherein said predetermined area of the adhesive layer is adjacent to the at least one adhesive layer aperture.  
   
   
       12 . The apparatus of  claim 1 , wherein the substrate is an organic circuit board.