US2007119131A1PendingUtilityA1

Chemical filter arrangement for asemiconductor manufacturing apparatus

Assignee: CANON KKPriority: Nov 19, 2001Filed: Jan 30, 2007Published: May 31, 2007
Est. expiryNov 19, 2021(expired)· nominal 20-yr term from priority
B01D 2253/3425B01D 46/521G03F 7/70858B01D 2257/70B01D 2253/102F24F 3/167B01D 2258/0216B01D 2253/206B01D 53/0454G03F 7/70916B01D 46/12B01D 46/0036B01D 2267/40B01D 2257/30B01D 53/0438B01D 53/0446F24F 8/15
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Claims

Abstract

Disclosed is a semiconductor exposure apparatus which includes a chamber for accommodating therein a main unit of the exposure apparatus, a gas controlling unit for controlling a gas in the chamber, a chemical filter for attracting a chemical substance in a controlling gas, and a dust removing filter for catching a dust particle in a controlling gas, wherein a gas blowing area of the chemical filter is smaller than that of the dust removing filter, wherein said chemical filter and said dust removing filter are disposed separately from each other. The chemical filter is mounted obliquely with respect to a direction of flow of a supplied gas. A gas rectifying device is disposed at a gas inlet side of the chemical filter and the dust removing filter. The chemical filter can he a pleat filter, and it is mounted so that the pleat thereof is orthogonal to the direction of flow of the supplied air.

Claims

exact text as granted — not AI-modified
1 .- 6 . (canceled)  
     
     
         7 . An apparatus comprising: 
 a dust removing filter disposed in a path of gas flow; and    a chemical filter disposed obliquely in the gas flow path upstream of said dust removing filter, wherein an area of said chemical filter is smaller than that of said dust removing filter.    
     
     
         8 . An apparatus according to  claim 7 , further comprising an exposure unit configured to expose a substrate to radiation, and a booth for accommodating said exposure unit therein, wherein the gas flow through said chemical filter and said dust removing filter is supplied into said booth.  
     
     
         9 . An apparatus comprising: 
 a dust removing filter disposed in a path of gas flow; and    a chemical filter disposed obliquely in the gas flow path upstream of said dust removing filter.    
     
     
         10 . An apparatus according to  claim 9 , further comprising an exposure unit configured to expose a substrate to radiation, and a booth for accommodating said exposure unit therein, wherein the gas flow through said chemical filter and said dust removing filter is supplied into said booth.  
     
     
         11 . An apparatus comprising: 
 a dust removing filter disposed in a path of gas flow; and    a chemical filter disposed in the gas flow path upstream of said dust removing filter, wherein an area of said chemical filter is smaller than that of said dust removing filter.    
     
     
         12 . An apparatus according to claim  1   1 , further comprising, an exposure unit configured to expose a substrate to radiation, and a booth for accommodating said exposure unit therein, wherein the gas flow through said chemical filter and said dust removing filter is supplied into said booth.

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