Revolution member supporting apparatus and semiconductor substrate processing apparatus

Abstract

A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member, and which revolve around the axis of rotation when the rotatable member rotates, wherein the holding members are allowed to swing about their own central axes.

1 . A revolution member supporting apparatus, comprising: 
 a rotatable member which rotates about an axis of rotation; and    a plurality of holding members which are disposed along a circle having a center corresponding to said axis of rotation of said rotatable member, and which revolve around said axis of rotation when said rotatable member rotates;    wherein said holding members are allowed to rotate about their own central axes.    
     
     
         2 . The revolution member supporting apparatus according to  claim 1 , wherein each of said holding members has a free end with an arc-like recess for engaging a peripheral portion of an object to be rotated.  
     
     
         3 . The revolution member supporting apparatus according to  claim 1 , wherein said holding members are allowed to rotate to a predetermined degree of angle about their own central axes.  
     
     
         4 . The revolution member supporting apparatus according to  claim 1 , wherein each of said holding members has a center of gravity deviated from said central axis of said holding member.  
     
     
         5 . The revolution member supporting apparatus according to  claim 4 , wherein a weight is attached to said holding member, said weight having a center of gravity at a distance from said central axis of said holding member.  
     
     
         6 . The revolution member supporting apparatus according to  claim 1 , wherein each of said holding members can move between an engaging/holding position where said holding member engages a peripheral portion of an object to be rotated, and a release position where said holding member is detached from said object to be rotated along a radial direction of said rotatable member.  
     
     
         7 . The revolution member supporting apparatus according to  claim 6 , further comprising an elastic body that causes said holding member located in said engaging/holding position to engage elastically with the peripheral portion of said object to be rotated.  
     
     
         8 . The revolution member supporting apparatus according to  claim 7 , wherein said elastic body comprises a spring.  
     
     
         9 . A semiconductor substrate processing apparatus, comprising: 
 a carry-in and carry-out section for carrying in and carrying out a semiconductor substrate having a surface on which a circuit is formed, in a dry state;    a plated metal film forming unit for forming a plated metal film on said semiconductor substrate which has been carried in;    a cleaning unit for cleaning said semiconductor substrate held by a revolution member supporting apparatus; and    a transfer mechanism for transferring said semiconductor substrate between said units;    wherein said revolution member supporting apparatus comprises:    a rotatable member which rotates about an axis of rotation; and    a plurality of holding members which are disposed along a circle having a center corresponding to said axis of rotation of said rotatable member, and which revolve around said axis of rotation when said rotatable member rotates;    wherein said holding members are allowed to rotate about their own central axes.    
     
     
         10 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a polishing unit for polishing at least part of said plated metal film on said semiconductor substrate.  
     
     
         11 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a reinforcing seed layer forming unit for forming a reinforcing seed layer on said semiconductor substrate.  
     
     
         12 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a seed layer forming unit for forming a seed layer on said semiconductor substrate.  
     
     
         13 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a barrier layer forming unit for forming a barrier layer on said semiconductor substrate.  
     
     
         14 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a cap plating unit for forming a plated cap layer on said semiconductor substrate.  
     
     
         15 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising a bevel etching unit for etching and removing at least one of said plated metal film, a seed layer and a barrier layer formed at a peripheral edge portion of said semiconductor substrate.  
     
     
         16 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising at least one of a film thickness measuring instrument for measuring a thickness of a film formed on said semiconductor substrate and a detection sensor for detecting a surface state of a film formed on said semiconductor substrate.  
     
     
         17 . The semiconductor substrate processing apparatus according to  claim 9 , wherein each of said units is interchangeable.  
     
     
         18 . The semiconductor substrate processing apparatus according to  claim 9 , wherein in said plated metal film forming unit, plating treatment and cleaning treatment are performed in such a state that said semiconductor substrate is held by a substrate holding portion.  
     
     
         19 . The semiconductor substrate processing apparatus according to  claim 9 , further comprising an annealing unit for annealing said semiconductor substrate.  
     
     
         20 . Rotatable holding members for holding a disc-shaped object, characterized in that said holding members are disposed along a circle having a center corresponding to an axis of rotation, and adapted to revolve around said axis of rotation and rotate about their own central axes so that portions of the disc-shaped object, which engages said holding members, are shifted when holding members revolve.  
     
     
         21 . A semiconductor substrate processing apparatus, comprising: 
 a carry-in and carry-out section for carrying in and carrying out a semiconductor substrate having a surface on which a circuit formed, in a dry state;    a plated metal film forming unit for forming a plated metal film on said semiconductor substrate which has been carried in;    a bevel etching unit for etching and removing at least one of a plated metal film, a seed layer and a barrier layer formed at a peripheral edge portion of said semiconductor substrate held by a revolution member supporting apparatus; and    a transfer mechanism for transferring said semiconductor substrate between said units;    wherein said revolution member supporting apparatus comprises:    a rotatable member which rotates about an axis of rotation; and    a plurality of holding members which are disposed along a circle having a center corresponding to said axis of rotation of said rotatable member, and which revolve around said axis of rotation when said rotatable member rotates;    wherein said holding members are allowed to rotate about their own central axes.    
     
     
         22 . The semiconductor substrate processing apparatus according to  claim 21 , further comprising an annealing unit for annealing said semiconductor substrate.  
     
     
         23 . The semiconductor substrate processing apparatus according to  claim 21 , further comprising an aligner unit for aligning an orientation flat or a notch of the semiconductor substrate with a predetermined direction.  
     
     
         24 . The semiconductor substrate processing apparatus according to  claim 21 , further comprising a chemical liquid supply system for supplying a plating liquid to said plated metal film forming unit.  
     
     
         25 . The semiconductor substrate processing apparatus according to  claim 21 , further comprising a cleaning unit for cleaning said semiconductor substrate.  
     
     
         26 . A revolution member supporting apparatus for holding a disc-shaped object, comprising: 
 a rotatable member which rotates about a given axis of rotation; and    a plurality of holding members which are disposed at equal intervals along a circle having a center corresponding to said axis of rotation, and which engage the periphery of said object to hold said disc-shaped object such as a semiconductor wafer;    wherein each of said holding members has an arc-like surface portion for making a friction engagement with the periphery of said disc-shaped object, and is allowed to rotate about a central axis of an arc of said arc-like surface.