Method and apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

Abstract

An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

1 . An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers, comprising: 
 a base plate configured to support a plurality of green sheet layers thereon, said base plate having at least one resiliently mounted load support bar disposed adjacent an outer edge of said base plate;    said at least one load support bar mounted on one or more biasing members such that the top surface of said at least one load support bar extends above the top surface of said base plate by a selected distance.    
   
   
       2 . The apparatus of  claim 1 , wherein said selected distance corresponds to a distance representing a gap created by a pillow effect stack of green sheet layers.  
   
   
       3 . The apparatus of  claim 2 , wherein said biasing members are configured so as to maintain the top surface of said at least one load support bar above the top surface of said base plate at substantially said selected distance when said base plate is loaded with said plurality of green sheet layers thereon in an uncompressed state.  
   
   
       4 . The apparatus of  claim 3 , wherein said base plate is configured to accommodate downward movement of said at least one load support bar, up to said selected distance, during compression of said plurality of green sheet layers.  
   
   
       5 . The apparatus of  claim 4 , wherein said biasing members further comprise at least one of: a spring material, a silicone rubber insert material, a bubble material and a tube material.  
   
   
       6 . The apparatus of  claim 4 , wherein said at least one load support bar comprises a C-shaped member disposed within channels formed in said base plate.  
   
   
       7 . The apparatus of  claim 1 , wherein said at least one load support bar is arranged at a location corresponding to a non-functional region of said green sheet layers.  
   
   
       8 . An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers, comprising: 
 a segmented frame assembly for receiving a green sheet stack therein; said segmented frame assembly configured for lateral insertion of one or more coupons to be placed between at least a pair of individual green sheets;    wherein said segmented frame assembly and said one or more coupons are configured to flatten said pair of individual green sheets with respect to one another and prevent lateral movement therebetween.    
   
   
       9 . The apparatus of  claim 8 , wherein a first portion of said one or more coupons are positioned over non-functional regions of a given green sheet layer, and a second portion of said one or more coupons are affixed between sections of said segmented frame assembly.  
   
   
       10 . The apparatus of  claim 9 , wherein said one or more coupons are positioned so as to be sheared upon a compressive force applied to the top of said green sheet stack.  
   
   
       11 . The apparatus of  claim 8 , further comprising: 
 a set of bottom frame segments;    at least one set of one middle frame segments interlocking with said set of bottom frame segments; and    a set of top frame segments interlocking with said at least one set of middle frame segments.    
   
   
       12 . The apparatus of  claim 11 , wherein said at least one set of middle frame segments are configured with the capability for lateral movement with respect to said set of top frame segments and said set of bottom frame segments.  
   
   
       13 . The apparatus of  claim 11 , wherein: 
 a first set of coupons is affixed between an upper lip of said set of bottom frame segments and a lower lip of said at least one set of middle frame segments; and    a second set of coupons is affixed between an upper lip of said at least one set of middle frame segments and a lower lip of said set of top frame segments.    
   
   
       14 . A method for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers, the method comprising: 
 forming sacrificial paste patterns on at least one non-functional region of at least one green sheet in a multi-layer green sheet stack; and    compressing said multi-layer green sheet stack to form a laminate, sintering said laminate and removing peripheral edges of said laminate including said sacrificial paste patterns therein.    
   
   
       15 . The method of  claim 14 , wherein said sacrificial paste patterns have a height substantially equivalent to the height of functional paste patterns formed on said at least one green sheet.  
   
   
       16 . The method of  claim 14 , wherein said sacrificial paste patterns are formed from the same material as said functional paste patterns.  
   
   
       17 . A method for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers, the method comprising: 
 mounting at least one thickness compensation frame within a lamination tool, said at least one thickness compensation frame having at least one width corresponding to at least one width of a non-functional region of an individual green sheet in a multi-layer green sheet stack;    wherein a total height of said at least one thickness compensation frame is substantially equivalent to a distance representing a gap created by pillow effect stacking of said multi-layer green sheet stack.    
   
   
       18 . The method of  claim 17 , wherein said at least one thickness compensation frame is mounted beneath said multi-layer green sheet stack.  
   
   
       19 . The method of  claim 18 , wherein said at least one thickness compensation frame comprises at least one of: a green sheet material, a polymeric organic material, and a metallic material.  
   
   
       20 . The method of  claim 17 , wherein a plurality of thickness compensation frames are interleaved between individual green sheets of said multi-layer green sheet stack.