US2007111644A1PendingUtilityA1

Thick perforated polishing pad and method for making same

Assignee: PRESTON SPENCERPriority: Sep 27, 2005Filed: Sep 27, 2006Published: May 17, 2007
Est. expirySep 27, 2025(expired)· nominal 20-yr term from priority
B24B 37/26B24B 37/24B24D 18/00
35
PatentIndex Score
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Claims

Abstract

A thick perforated polishing pad and method for making same which includes a polishing pad having a thick polymer sheet with multiple circular openings or perforations contained therein that are produced in the pad by machining techniques such as drilling.

Claims

exact text as granted — not AI-modified
1 . A polishing pad comprising a thick polymer layer having a top surface, a bottom surface, and a plurality of openings contained therein which are drilled into the polymer layer.  
     
     
         2 . The polishing pad of  claim 1  wherein the plurality of openings do not traverse the bottom surface of the polymer layer.  
     
     
         3 . The polishing pad of  claim 1  wherein the thick polymer layer is comprised of a closed cell polyurethane.  
     
     
         4 . The polishing pad of  claim 1  wherein the polymer layer has a shore hardness within a range of 40 to 80 shore D.  
     
     
         5 . The polishing pad of  claim 1  having a thickness of 0.100 inches or greater.  
     
     
         6 . The polishing pad of  claim 5  wherein the openings have a diameter less than or equal to 0.100 inches.  
     
     
         7 . The polishing pad of  claim 1  further comprising one or more grooves in the top surface of the polishing pad.  
     
     
         8 . The polishing pad of  claim 1  wherein a diameter of the openings is less than or equal to a thickness of the pad.  
     
     
         9 . A method for making a polishing pad comprising the steps of: 
 a. providing a thick polymer layer having a top surface and a bottom surface; and    b. simultaneously drilling a plurality of openings into the thick polymer layer.    
     
     
         10 . The method of  claim 9  wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings into the thick polymer layer without traversing the bottom surface of the layer.  
     
     
         11 . The method of  claim 9  wherein the step of providing a thick polymer layer comprises the step of providing a thick layer of a closed cell polyurethane.  
     
     
         12 . The method of  claim 9  wherein the step of providing a thick polymer layer comprises the step of providing a polymer layer having a shore hardness within a range of 40 to 80 shore D.  
     
     
         13 . The method of  claim 9  wherein the step of providing a thick polymer layer comprises the step of providing a polymer layer having a thickness of 0.100 inches or greater.  
     
     
         14 . The method of  claim 13  wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings having a diameter less than or equal to 0.100 inches.  
     
     
         15 . The method of  claim 9  further comprising the step of cutting one or more grooves in the top surface of the thick polymer layer.  
     
     
         16 . The polishing pad of  claim 9  wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings having a diameter less than or equal to a thickness of the thick polymer layer.

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