Substrate assembly, method of testing the substrate assembly, electrooptical device, method of manufacturing the electrooptical device, and electronic equipment

Abstract

The present invention provides a systems and methods to perform an electrical test on a substrate assembly used as a TFT array substrate of a liquid-crystal device without detaching a mounted external IC. The substrate assembly can include a substrate, a peripheral circuit embedded in the substrate, a first wiring arranged on the substrate, and an external IC, mounted on the substrate, and having a first terminal connected to an interconnection portion arranged on the first wiring. The substrate assembly can further include a second wiring which extends from the interconnection portion in such a manner that the second wiring is routed in a portion of the substrate facing the integrated circuit, and a first external circuit connection terminal arranged on the second wiring in a portion of the substrate not facing the integrated circuit. The external IC is thus tested through the external circuit connection terminal.

1 . An electrooptical device comprising, on a substrate, 
 a pixel electrode;    at least one of a wiring and an electronic element that drive the pixel electrode;    an integrated circuit which, when mounted on the substrate, forms at least a portion of a driving circuit connected to at least the one of the wiring and the electronic element; and    predetermined trace patterns arranged beneath the integrated circuit.    
   
   
       2 . The electrooptical device according to  claim 1 , the predetermined trace patterns comprising at least one of a trace pattern that evaluates a manufacturing process, a trace pattern that test the manufacturing process, and a trace pattern that monitors the manufacturing process, while being formed in an area of the substrate other than interconnection pads to which input and output terminals of the external integrated circuit are connected.  
   
   
       3 . An electrooptical device comprising, on a substrate, 
 a pixel electrode;    at least one of a wiring and an electronic element that drive the pixel electrode;    an integrated circuit which, when mounted on the substrate, forms at least a portion of a driving circuit connected to at least the one of the wiring and the electronic element; and    a bottom circuit arranged beneath the integrated circuit and embedded together with at least the one of the wiring and the electronic element.    
   
   
       4 . The electrooptical device according to  claim 3 , the integrated circuit forming a portion of the driving circuit, and 
 the bottom circuit forming another portion of the driving circuit.    
   
   
       5 . The electrooptical device according to  claim 4 , 
 the wiring comprising a data line and a scanning line,    the integrated circuit comprising a data line driving circuit that drives the data line, and    the bottom circuit comprising a scanning line driving circuit that drives the scanning line and a sampling circuit that samples a video signal and supplies the data line with the sampled video signal.    
   
   
       6 . An electrooptical device according to  claim 3 , the bottom circuit comprising a test circuit.  
   
   
       7 . An electrooptical device according to  claim 3 , 
 the electronic element comprising a first thin-film transistor connected to the pixel electrode, and    the bottom circuit comprising a second thin-film transistor which is manufactured through the same manufacturing process as that of the first thin-film transistor.    
   
   
       8 . An electrooptical device according to  claim 3 , an insulator being formed between the integrated circuit and the bottom circuit.  
   
   
       9 . The electrooptical device according to  claim 1 , the integrated circuit being arranged in a peripheral area surrounding an image display area within which the pixel electrode is arranged.  
   
   
       10 . The electrooptical device according to  claim 1 , the top layer of the substrate on which the integrated circuit is to be mounted being planarized.  
   
   
       11 . A manufacturing method of manufacturing the electrooptical device of  claim 1 , comprising: 
 a first formation step for forming a predetermined trace pattern within a predetermined area on the substrate;    performing at least one of the test, evaluation, and monitoring of a manufacturing process in accordance with the predetermined trace pattern;    a second formation step for forming at least the one of the wiring and the electronic element; and    mounting the integrated circuit on the predetermined area.    
   
   
       12 . A manufacturing method of manufacturing the electrooptical device of  claim 3 , comprising: 
 forming a bottom circuit within a predetermined area on the substrate, the one of the wiring and the electronic element, and the pixel electrode, and    mounting the integrated circuit on the predetermined area.    
   
   
       13 . The electrooptical device according to  claim 1 , the predetermined trace pattern comprising at least one of an alignment mark and an identification mark.  
   
   
       14 . An electrooptical device according to  claim 3 , the bottom circuit comprising a circuit element, and the electrooptical device comprising: 
 a lead wiring extending from the circuit element, and    an external circuit connection terminal for the bottom circuit connected to the lead wiring in a portion of the substrate not facing the integrated circuit.    
   
   
       15 . An electrooptical device, comprising: 
 a substrate;    a peripheral circuit embedded in the substrate;    a first wiring arranged on the substrate;    an integrated circuit comprising a first terminal connected to an interconnection portion arranged on the first wiring on the substrate;    a second wiring which extends from the interconnection portion in such a manner that the second wiring is routed in a portion of the substrate facing the integrated circuit; and    a first external circuit connection terminal arranged on the second wiring in a portion of the substrate not facing the integrated circuit;    the electrooptical device further comprising, on the substrate,    a pixel electrode, and    at least one of a wiring and an electronic element that drives the pixel electrode, and    the integrated circuit, mounted on the substrate, forming at least a portion of a driving circuit connected to at least the one of the wiring and the electronic element, and    at least one of a predetermined trace pattern and a bottom circuit being arranged beneath the integrated circuit.