Heat-dissipating unit and related liquid cooling module

Abstract

A liquid cooling module includes a heat-absorbing unit, a heat-dissipating unit, a outlet pipe and a inlet pipe. The heat-dissipating unit includes a tank configured for receiving a coolant therein, a pump disposed in the tank, at least one thermoelectric device and at least one heat sink. The thermoelectric device has a first surface and a second surface facing away the first surface, the first surface thereof is attached to the tank. The heat sink is attached to the second surface of the thermoelectric device. The outlet pipe interconnects the heat-absorbing unit and the pump. The inlet pipe interconnects the tank and the heat-absorbing unit. The liquid cooling module has a small volume, and can be easily disposed in a computer enclosure.

1 . A liquid cooling module comprising: 
 a heat-absorbing unit;    a heat-dissipating unit comprising: 
 a tank configured for receiving a coolant therein;  
 a pump disposed in the tank;  
 at least one thermoelectric device having a first surface and a second surface facing away from the first surface, the first surface thereof being attached to the tank; and  
 at least one heat sink attached to the second surface of the thermoelectric device,  
   an outlet pipe interconnecting the heat-absorbing unit and the pump; and    an inlet pipe interconnecting the tank and the heat-absorbing unit.    
   
   
       2 . The liquid cooling module as claimed in  claim 1 , wherein the heat-dissipating unit further comprises a coolant level meter in communication with the tank, the coolant level meter having a coolant level observing window.  
   
   
       3 . The liquid cooling module as claimed in  claim 2 , wherein the coolant level meter has a coolant inlet for supplying the coolant into the tank.  
   
   
       4 . The liquid cooling module as claimed in  claim 1 , wherein a thermal interface material is disposed between the tank and the thermoelectric device.  
   
   
       5 . The liquid cooling module as claimed in  claim 1 , wherein a thermal interface material is disposed between the thermoelectric device and the heat sink.  
   
   
       6 . The liquid cooling module as claimed in  claim 1 , wherein the heat-dissipating unit further comprises at least one fan attached to the at least one heat sink.  
   
   
       7 . The liquid cooling module as claimed in  claim 3 , wherein the heat-dissipating unit further comprises a casing having a plurality of heat-dissipating holes defined therein spatially corresponding to the heat sink and a hole aligned with the coolant inlet of the coolant level meter.  
   
   
       8 . A heat-dissipating unit comprising: 
 a tank configured for receiving a coolant therein;    a pump disposed in the tank;    at least one thermoelectric device having a first surface and a second surface facing away from the first surface, the first surface thereof being attached to the tank; and    at least one heat sink attached to the second surface of the thermoelectric device.    
   
   
       9 . The heat-dissipating unit as claimed in  claim 8 , wherein the heat-dissipating unit further comprises a coolant level meter in communication with the tank, the meter device having a coolant level observing window.  
   
   
       10 . The heat-dissipating unit as claimed in  claim 9 , wherein the coolant level meter has a coolant inlet for supplying the coolant into the tank.  
   
   
       11 . The heat-dissipating unit as claimed in  claim 8 , wherein a thermal interface material is disposed between the tank and the thermoelectric device.  
   
   
       12 . The heat-dissipating unit as claimed in  claim 8 , wherein a thermal interface material is disposed between the thermoelectric device and the heat sink.  
   
   
       13 . The heat-dissipating unit as claimed in  claim 8 , wherein the heat-dissipating unit further comprises at least one fan attached to the heat sink.  
   
   
       14 . The liquid cooling module as claimed in  claim 10 , wherein the heat-dissipating unit further comprises a casing having a plurality of heat-dissipating holes defined therein spatially corresponding to the heat sink and a hole aligned with the coolant inlet of the coolant level meter.